Backplanes and Patchpanels
Molex extends Impact Backplane Connector System with two new configurations
Molex Incorporated has released two additions to the Impact Backplane Connector System, its high-speed, high-density connector system for the telecommunication and data networking market. The Impact CoPlanar Connector System and Impact Mezzanine Connector System provide the ultimate flexibility to optimise designs for superior mechanical and electrical performance.
AMCs as an add-on for MicroTCA systems
Every interface and every signal transfer carries within it a potential source of error – not only on a technological level, but also in terms of interpersonal communication. This explains the desire of many developers and system integrators: To have to explain everything just once and then obtain as much as possible from just one supplier and from a single source. ELMA has therefore extended its product range to include "Integrated Products". AMCs will now also be supplied for MicroTCA systems.
High-density 48-port UTP patch panel from Tyco
A new range of high-density UTP patch panels which require only 1U rack space has been introduced by the AMP NETCONNECT business unit of Tyco Electronics.
PC/104 and PC/104-Plus connectors from In2Connect
At the beginning of the 90s the demand for electronic goods such as PCs was huge in all sectors. The performance of the embedded microcomputer application grew rapidly, as did, unfortunately, the problem of creating a low-cost connection between two motherboards. Industry had to find a way to connect at least two motherboards together without needing to use a card cage or a backplane. In addition, the components had also to be easily separated or replaced at any time.
High density backplane connector family available from TTI
TTI, Inc has announced the Tyco Z-PACK TinMan Backplane Connector family, a cost-effective solution for customers searching for a high density, high performance backplane interconnect system. The Z-PACK TinMan connector design offers a fully protected right-angle receptacle for use on daughter cards where handling damage can be a concern when mating to a vertical male header.
Molex Signs Amphenol as Second-Source for Backplane Interconnect Family
Molex and Amphenol TCS (ATCS) have signed a cross license / second-source licensing agreement that gives ATCS the right to manufacture, market and sell the I-Trac Backplane Connector System worldwide. Molex is pleased to announce this latest development in the Molex-ATCS relationship," said Martin Slark, Chief Executive Officer of Molex. "The technology behind our I-Trac design offers users unmatched versatility and performance. By partnering with ATCS we will be able to expand the availability of this leading technology throughout the industry."
