Industry News

TI completes acquisition of Spansion Japan wafer fabrication facility

Texas Instruments Incorporated (NYSE: TXN) has completed its acquisition of two wafer fabs and equipment in Aizu-Wakamatsu, Japan, cost-effectively increasing the company's production capacity. The facility was previously operated by Spansion Japan Limited (SJL) and was acquired under a court-approved plan of reorganization.

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European collaborative research to develop lab-on-chip system for cheap and fast cancer diagnosis

Today, at the Engineering in Medicine and Biology Conference (EMBC) in Buenos Aires (Argentina), imec and its project partners announce the launch of the European Seventh Framework Project MIRACLE. The MIRACLE project aims at developing an operational lab-on-chip for the isolation and detection of circulating and disseminated tumor cells (CTCs and DTCs) in blood. The new lab-on-chip is an essential step towards faster and cost-efficient diagnosis of cancer.

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Sanmina-SCI named as Nujira Supplier of the Year

Sanmina-SCI named as Nujira Supplier of the Year

Nujira has presented its first ever Supplier of the Year award to Sanmina-SCI, in Shenzhen, China. Sanmina-SCI started volume production of the Nujira Coolteq™.h power modulator module for cellular base stations in December 2008. Nujira Coolteq modules can halve the energy consumption of 3G and 4G base stations by improving the efficiency of the RF transmission circuits.

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SRG Recent Report Finds MediaTek WiMAX SoC Outperformed Its Peer Products

MediaTek Inc., a leading fabless semiconductor company for wireless communications and digital multimedia solutions, today announces that its WiMAX SoC was almost consistently the top performing solution in a recent independent performance benchmark test of leading Mobile WiMAX(TM) chipsets. The MediaTek WiMAX chipset (CPE form factor) outperformed four of its peers (USB dongle and Minicard form factors) of the same product segment in a wide variety of tests designed to test the capabilities of the chipsets under challenging network conditions.

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MediaTek Signs LTE Licensing Agreement with NTT DOCOMO

MediaTek Inc., a leading fabless semiconductor company for wireless communications and digital multimedia solutions, announces it has entered into a licensing agreement with NTT DOCOMO, INC. regarding "LTE-PF," a mobile-terminal platform based on Long Term Evolution (LTE). Upon the completion of the LTE-PF licensing agreement with DOCOMO, MediaTek plans to integrate this LTE technology with its 2G and 3G technologies to provide solutions for Japan and global markets.

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Agilent Technologies Introduces Turbomolecular Vacuum Pump Portfolio

Agilent Technolo announced a new line of turbomolecular high vacuum pumps, well-suited for ultra-high vacuum (UHV) applications requiring the highest level of compression ratios for light gases.

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Agilent Technologies Updates Human Exon Target Enrichment Tool, Featuring New Expressed Genome Content and Optimized Uniformity

Agilent introduced the SureSelect Human All Exon v2 Target Enrichment kit, which was developed in close collaboration with the Broad Institute of MIT and Harvard. The kit, the 15th SureSelect product in Agilent's portfolio, is a single tube assay that allows researchers to streamline experiments by sequencing the expressed genome while discarding regions not of interest.

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Micron Technology Optimizes Process Control With Applied Materials' E3 Equipment Control System

Micron Technology, Inc. (Nasdaq:MU) announced today that it has started the deployment of the Applied Materials E3(TM) framework within its 300 millimeter (mm) fabrication facilities. E3 is an integrated engineering system that allows sophisticated control strategies aimed at increasing product performance, raising product yield and improving quality.

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Foton Motor and Freescale Semiconductor announce Automotive Joint Lab

Foton and Freescale Semiconductor announced the establishment of the Automotive Joint Lab. The lab is Foton Motor's first formal cooperation project in automotive electronics, providing evidence of the enhanced R&D investment and development Foton Motor is making in this area.

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Learn how to quickly and easily parallelize your embedded multicore programs at ESC Boston

Vector Fabrics announces it will be conducting demonstrations of its vfAnalyst tool during ESC Boston 2010. The cloud-based tool allows software engineers to easily identify the most promising parallelization opportunities within their C code, greatly easing the time-consuming and expensive process to create an effective multicore implementation.

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Zenaro Lighting GmbH founded - Everlight cooperates with Hans-Dieter Wustlich

Zenaro Lighting GmbH founded - Everlight cooperates with Hans-Dieter Wustlich

Following the official launch of the Zenaro Lighting Alliance in April 2010 - a global company alliance between founding members Everlight Electronics (Taiwan), LCC (Germany) and Aphos Lighting (USA) that was established to confront the future challenges of the global lighting market by bundling the members' LED technology and lighting expertise - the foundation of a new company Zenaro Lighting GmbH was announced today.

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Broadcom to Demonstrate Industry's First and Only 'In Box' 10GbE iSCSI HBA Solution for VMware vSphere 4.1 at VMworld 2010

Broadcom Corporation (Nasdaq: BRCM), a global leader in semiconductors for wired and wireless communications, today announced the industry's first and only 10 Gigabit Ethernet (10GbE) iSCSI / 1 Gigabit Ethernet (1GbE) iSCSI host bus adapter (HBA) and boot solution to be supported 'in box' in VMware's vSphere(TM) 4.1. Broadcom's leading-edge iSCSI solution provides twice the input/output operations per second (IOPs), twice the bandwidth and twice the CPU effectiveness when compared to network interface cards (NICs) without iSCSI HBA capabilities. Additionally, it frees resources that can be utilized to enable the creation of even more virtual machines (VM) on the vSphere(TM) 4.1 platform. This high performance iSCSI HBA solution will be demonstrated using Broadcom's NetXtreme(R) II 10GbE converged network interface controller (C-NIC) at VMworld 2010 this week in San Francisco (Booth #1601).

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Etek Europe enters a Recruiting phase

Etek Europe, a leading supplier of products and services to the European electronics industry, has announced that due to rapid growth and expansion of Etek Europe Ltd., there are now new employment opportunities for the successful candidates to become part of the Etek team.

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Fujitsu USB 3.0-SATA Bridge IC Earns USB-IF Certification

Fujitsu USB 3.0-SATA Bridge IC Earns USB-IF Certification

Fujitsu announced that the latest series of the Fujitsu USB 3.0-SATA bridge IC, has passed USB-IF compliance testing conducted by the USB Implementers Forum and is now certified as compliant with the USB 3.0 SuperSpeed standard.

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Audio Precision Goes Direct In The UK & Ireland

Audio Precision has opened an office in the United Kingdom. UK customers will see the immediate benefits of lower prices and faster access to AP technical expertise. The new office is headed by British audio test engineer James Kelly, who has been developing custom test solutions using AP analysers for over 20 years.

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H3C Technologies selects Freescale QorIQ processors for network switch infrastructure equipment

H3C Technologies, a leading global supplier of IP-based products and solutions, has selected QorIQ multicore processor technology from Freescale Semiconductor for a line of next-generation multi-service routing switches.

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Tool eases application of IEC 61508

Tool eases application of IEC 61508

RiskCAT, distributed by Hitex, supports the efficient application of standards and norms for safety-critical electronic systems.

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VSN Systemen Selects Octasic’s Vocallo MGW for Multimedia Application Portfolio

Octasic Inc., a leading innovator of media processing and wireless solutions, today announced that its Vocallo MGW multi-core DSP platform has been chosen by VSN Systemen, a leading telecom hardware and software developer, to power the media processing unit (MPU) of its newly launched OpenTSP NG portfolio. Octasic's low power high performance processing technology gives systems integrators and solutions providers a robust platform for today's most performance-demanding applications.

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MOST Presentation at SAE Convergence 2010

MOST Presentation at SAE Convergence 2010

At SAE Convergence on October 19 to 20, 2010, the MOST Cooperation (the organization, through which the leading automotive multimedia network Media Oriented Systems Transport (MOST) is standardized) will demonstrate that MOST Technology is ready for extended multimedia and information applications in the vehicle. MOST150 now meets the requirements not only for the traditional areas of entertainment and information, but also for the new domains of mobile connectivity, connected services, and driver assistance thus completing the five major fields of in-car use cases. During this leading automotive exhibition in Detroit (Michigan, United States), a MOST demonstrator will be showing that MOST supports star, daisy-chain, tree and other topologies as well as different physical layers: plastic optical fibers (POF), COAX based electrical physical layer and unshielded twisted pair (UTP) of copper wires.

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Solyndra Receives ISO 9001:2008 Certification from TüvRheinland

Solyndra, Inc., a manufacturer of innovative cylindrical solar photovoltaic (PV) systems for commercial and industrial rooftops, today announced it has earned ISO 9001:2008 certification, an internationally recognized standard issued to organizations with a quality management system. The certificate was authorized by TüvRheinland.

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NXP Cortex-M0 LPC1100 Design Challenge Receives Record Number of Designs

NXP Semiconductors and EE Times have completed the Cortex-M0 LPC1100 Design Challenge by announcing the final four winners. The challenge resulted in over 500 LPCXpresso enabled designs from over 40 countries and has fostered a social community with 1600 members and received over 25,000 unique web visitors. All qualified contestants received LPCXpresso development systems with integrated LPC-Link which provided a common Eclipse based platform for software development and enabled seamless system integration into their final designs. Using LPCXpresso, contestants explored the capabilities of the Cortex-M0 LPC1100 and showed through their exciting designs what they could do with 65c.

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Hanvon selects Freescale’s i.MX51 applications processor for next generation eReader products

Leading Chinese eReader manufacturer Hanvon has selected Freescale Semiconductor's i.MX51 applications processor for its next generation eReader solutions. Consumers can look forward to optimal digital reading experiences and longer battery life from Hanvon eReader products utilizing Freescale technology.

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Datang Mobile selects multicore processors from Freescale Semiconductor to power 3G base stations

Datang Mobile Communications Equipment Co., Ltd. (Datang Mobile), one of China's largest telecom equipment manufacturers, has selected Freescale Semiconductor's dual-core QorIQ P2020 processor, six-core MSC8156 DSP and MD7IC2050N RF Power component for a popular line of TD-SCDMA base stations.

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ONFI Introduces New 2.3 Specification With ECC Offload Functionality

The Open NAND Flash Interface (ONFI) Working Group, the organization dedicated to simplifying integration of NAND Flash memory into consumer electronic devices, computing platforms, and industrial systems, today introduced its new ONFI 2.3 specification, which includes the EZ-NAND protocol. EZ-NAND, which stands for error correction code (ECC) Zero NAND, was designed to remove the burden of the host controller to keep pace with the fast changing ECC requirements of NAND technology.

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KPIT Cummins becomes Authorized Tensilica System-on-Chip (SoC) Design Center

Tensilica, Inc. today announced that KPIT Cummins (BSE: 532400; NSE: KPIT), a leading product engineering and IT consulting partner to manufacturing companies, has joined Tensilica's Xtensions partner network and become an authorized design center. As a Tensilica Xtensions partner, KPIT Cummins will extend its capabilities to support customers on Xtensa core-based designs for a broad range of ASICs for infotainment and consumer electronics applications.

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Broadcom's Industry-Leading and Cost Effective HD ISDB-T Silicon Solutions are Designed Specifically for South America's Digital TV Transition

Broadcom Corporation announced its industry-leading ISDB-T product family designed specifically to support South America's transition to digital TV programming. With the industry's only integrated high definition (HD) ISDB-T tuner and demodulator, optimized software support and FastRTV™ channel change acceleration technology, Broadcom's technology enables new cost efficiencies while exceeding the requirements for performance, quality and low power.

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Mercury Computer Systems to Deliver High Speed Data Storage Subsystem to Raytheon for AN/TPY-2 Missile Defense Program

Mercury Computer Systems announced it will deliver systems architecture, development, qualification and integration services to Raytheon National & Theater Security Programs division for a rugged, high-speed data storage and recording subsystem to be deployed in the AN/TPY-2 Missile Defense Program.

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PCCW Deploys Huawei’s 40G OTN Network Solution

Huawei announced the deployment of their 40G Optical Transport Network (OTN) solution for PCCW, Hong Kong' s premier telecommunications provider and a world-class player in Information & Communications Technologies. This new network, using Huawei's OTN solution, enables PCCW's customers to enjoy premium service via higher bandwidth and more flexible service grooming features.

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China TieTong Expands Its CTTNET National Backbone Network Capacity with Huawei' s NE5000 Routers

Huawei, a leader in providing next-generation telecommunications network solutions for operators around the world, recently announced that it was selected by China TieTong Telecommunications Corporation (China TieTong), a wholly-owned subsidiary of China Mobile, as the sole provider for a massive expansion of CTTNET, a nationwide high-speed broadband IP network operated by China TieTong. Huawei will provide its advanced Quidway® NetEngine5000E (NE5000E) core routers for this project.

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AMD and TigerDirect Host Simulcast to Unveil the VISION Experience Center

AMD is deploying the next chapter in Retail 2.0 evolution with the introduction of the VISION Experience Center (VEC) by AMD during a simulcast and do–it-yourself computer system build. The simulcast will be hosted by Tony Fernandez-Stoll, director of Regional Marketing, AMD and George Ali, vice president of Merchandising, Components & DIY, TigerDirect

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RF Directional Coupler Offers hard to Find Interfaces

RF Directional Coupler Offers hard to Find Interfaces

RF directional couplers are readily available with common interfaces such as N type female connectors. Aviel Electronics, a division of RF Industries, designs and manufactures RF directional couplers with uncommon interfaces such as the HN female shown in the photo. The HN coaxial interface is a high-voltage version of the N interface and is used in specialized applications.

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Agilent Technologies and Johns Hopkins University to Research Novel Toxicity Pathways for Embryonic Brain Development Using Metabolomics

Agilent and the Agilent Foundation today announced that Dr. Thomas Hartung has received an Agilent Thought Leader Award in support of his research for the use of toxicity pathways to predict developmental neurotoxicity. This work could help identify possible contributions of chemicals to disorders such as autism and attention hyperactivity disorders. Dr. Hartung recently was named a leading toxicologist by the science journal Nature.

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Adept Scientific appoints new Managing Director

Adept Scientific appoints new Managing Director

The Board of Adept Scientific plc has announced that Mike Pisapia has been appointed Managing Director of the Company. He takes on this new role as Adept's co-founder, Dr Paul Bragg, steps back from the day-to-day running of the Company after 26 years at the helm. Paul remains Chairman of the Adept Scientific Group and will continue to play an active, hands-on role.

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Intelligent mains units

Intelligent mains units

NEW for IBC 2010 ~ the Bryant Unlimited eyePower Range of 14 Outlet Mains Distribution Units with OLED Display. These new intelligent mains distribution units arguably represent the pinnacle of UK mains unit design for IT, A/V and server racks. At IBC 2009 Bryant displayed a unit that monitored individual current outlets and displayed power consumption in 0.1W steps.

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Full Compatibility Confirmed for BrightSign Solid-State Digital Players and Philips-Branded Public Signage Displays with Smart Insert

Full Compatibility Confirmed for BrightSign Solid-State Digital Players and Philips-Branded Public Signage Displays with Smart Insert

BrightSign announced today that it has partnered with MMD, the exclusive marketer and reseller for Philips-branded LCD monitors and public signage solutions worldwide. With the partnership, system integrators and solution providers have the assurance that BrightSign's ultra-compact, PC-less digital controllers have been tested with Philips slim public signage solutions featuring Philips Smart Insert and are fully compatible. Combined, the players and displays provide a turnkey, high-definition digital signage solution with a lower total cost of ownership, substantial energy savings and easy upgrades. BrightSign's ability to tile and synchronise content across multiple displays with Philips' new 46" BDL 4681XU slim monitor was also confirmed.

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Major deal for Nujira handset technology

Nujira today announced that it has licensed its Coolteq.L handset technology to a Tier 1 semiconductor vendor in the handset ecosystem. Coolteq is an envelope tracking based technology that dramatically increases the power efficiency of transmitters in cellular handsets, network infrastructure, digital broadcasts and military communications.

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NXP Selected to Secure New German National Identity Card

NXP Selected to Secure New German National Identity Card

NXP announced that its SmartMX secure contactless microcontroller chip has been chosen to power the new German contactless National Identity card (Neuer Personalausweis). The German government has selected NXP as the supplier of an inlay solution containing a dedicated SmartMX chip, packaged in an ultra-thin module. Issuance of German contactless ID cards, which will replace the current paper-based IDs, will start in November 2010. More than 60 million cards are expected to be rolled out over the next ten years.

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Sky Deutschland Selects Broadcom's High Performance Chipsets for HD Set-Top Box and Sky+ DVR

Broadcom Corporation (Nasdaq: BRCM), a global leader in semiconductors for wired and wireless communications, today announced that Sky Deutschland, a leading pay-TV provider in Germany and Austria, has selected Broadcom's high performance and energy-efficient satellite set-top box (STB) system-on-a-chip (SoC) solutions to enable multi-channel high definition (HD) and digital video recorder (DVR) functionality for subscribers.

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Melexis receives “Supplier of the Year 2009” Award from Flexpower

Melexis receives “Supplier of the Year 2009” Award from Flexpower

Melexis, a leading supplier in mixed signal semiconductors and sensors, today announces it was honored by the Dr. Bob Roohparvar, CEO of Flexpower, a subsidiary of Flextronics and leading manufacturer of battery chargers for handheld devices, with the award of "Supplier of the Year 2009". For both companies this is the result and reward of a long-lasting relationship.

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Standard text and reference book on dynamics of machinery now available in English language

Today the English edition of the popular text book "Dynamics of Machinery" has been released by the Springer-Verlag. The well-known reference book, published in its 9th German edition last year, is now available in English language for students as well as experienced engineers. Methods and approaches for typical tasks in the field of mechanical engineering, detailed result interpretations as well as classical topics from dynamics of machinery form the central contents of the book. As in the German equivalent the books contains a CD-ROM with SimulationX, the standard simulation tool for engineers and scientists. By means of more than 60 modeling examples the reader can test his theoretical knowledge in the field.

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