connectors, receptacles, PCB headers, standard ribbon-cable assemblies

1.27 mm pitch wire-to-board IDT products

News Release from: TTI Inc.
19/09/2007

TTI, the authorized specialist distributor of passive, connector and electromechanical components offers the Molex Picoflex family of 1.27 mm (0.50 inch) pitch wire-to-board Insulation Displacement Technology (IDT) receptacles, PCB headers and standard ribbon-cable assemblies. This wide range of products delivers a high degree of flexibility and variety for design engineers looking at high-density interconnect applications.

Picoflex interconnects have been designed and tested to meet the stringent vibration and shock requirements of the automotive industry. Further key features include a low mated height and a rugged one-piece cable connector design with a four-point IDT cable interface.

The industry leading specifications and features of the Picoflex family of discrete wire receptacles has enabled it to become the connector interface of choice in a variety of applications, including car radios, VCRs, TVs, computer peripherals, household appliances and telecommunications equipment.