Production
MIRTEC to Showcase AOI and SPI Inspection Systems at NEPCON South China 2010
MIRTEC, the Global Leader in Inspection Technology, will showcase its advanced AOI and SPI systems at NEPCON South China 2010. MIRTEC will feature the latest in its award winning MV-7 Series ― the MV-7xi In-Line AOI System ― at the upcoming NEPCON South China 2010 show scheduled to take place Aug.31-Sep 2, 2010 in Shenzhen, China. All attendees are invited to visit MIRTEC for a firsthand demonstration of this new technology at booth 2B21
Illuminated Headband Magnifier Merges Convenience and Precision
An illuminated magnifier visor is among the most versatile and portable inspection instruments for basic electronics design, fabrication and inspection applications.
Integrated Technologies Ltd Chooses Blakell Europlacer
Blakell Europlacer Ltd., a designer and manufacturer of comprehensive SMT placement systems for the global electronics industry, announces that Integrated Technologies Ltd is transferring one of its existing SMT assembly lines to its Shanghai facility and has ordered a replacement line from Blakell Europlacer.
Short-travel probe for battery contact applications
The new P909 Series from Peak Test Services is a short-travel probe for battery contact applications. Depending on the application, it can be pressed or soldered to a printed-circuit board or used with a separate receptacle. For soldered use, a high-temperature solder-tight version is available.
Silicone grease from Chomerics combines multiple benefits for challenging military and aerospace applications
Chomerics Europe, a division of Parker Hannifin, has introduced a new conductive grease for use in both static and dynamic applications where good electrical contact is required between mating metallic surfaces. CHO-LUBE® E117 combines electrical conductivity (resistivity of less than 40 mΩ /cm), with lubrication, shielding, corrosion protection and heat dissipation in a single component compound that requires no cure cycle and has shelf life of two years.
IMAPS-UK “Beyond Solder” Technical Seminar Proclaimed A Success
On 30th June 2010, IMAPS-UK held a successful one-day technical seminar in conjunction with the Innovative electronics Manufacturing Research Centre (IeMRC), at the National Physical Laboratory (NPL) in Teddington, London.
Cookson Opens New Flux Manufacturing Facility
Cookson Electronics has constructed a new Alpha soldering flux manufacturing plant at its Enthone 's-Hertogenbosch site, in the Netherlands. The new plant has been designed for optimum flexibility, having no less than 11 mixing vessels and the capability to produce batch sizes from 100 to 7000 litres economically and efficiently. With an annual capacity of 1500 tonnes, the new facility boasts underground raw materials storage capacity of 110 tonnes and IPA storage of 40 tonnes, along with automated dosing; all in one ATEX zoned area. The installation has received independent certification from KIWA and is already in full production.
HCD restructures to service NPI and full production requirements
HCD, the contract electronics manufacturer, PCB design house, cable assembler and box build specialist, has responded to its clients requirements with the creation of a new volume production line in addition to its existing organisation which has been structured to respond very quickly to low volume orders typically placed by companies which are prototyping and trialling new products.
Imec EUV mask cleaning program on track towards EUV mass manufacturing
Imec today reported promising results in its Extreme Ultraviolet Lithography (EUV) mask cleaning program for defect-free EUV masks which are crucial in achieving high chip manufacturing yield. The research program was initiated in collaboration with mask cleaning experts of HamaTech APE GmbH & Co. KG., a fully owned subsidiary of Süss MicroTec AG, and some of imec's core partners.
Imec and ASML demonstrate potential of 193nm immersion lithography with freeform illumination
Imec and ASML collaborated to qualify ASML's Tachyon Source Mask Optimization and programmable illuminator system FlexRay™, proving its potential with the demonstration of a 22nm SRAM memory cell. In October 2010, the ASML XT:1900i lithography scanner at imec will be equipped with FlexRay™, enabling imec to step ahead and further explore the ultimate frontiers of immersion lithography.
Imec reports breakthrough in narrow pitch interconnects
Imec sets major step towards 20nm half pitch interconnects with the realization of electrically functional copper lines embedded into silicon oxide using a spacer-defined double patterning approach.
Intertronics Introduces Light-Curable Maskant For Surface Protection During Harsh Environment Processing
SpeedMask® 730-BT from Intertronics is a DYMAX masking resin, formulated to provide excellent surface protection during chemical milling/etching, plating, anodizing, and aggressive grit-blasting operations, thus aiding in the manufacturing, overhaul, repair and rework of turbine engine blades, vanes and other turbine components, as well as many other metal finishing applications. 730-BT is impervious to most acid and alkali solutions. This next-generation maskant is trimmable for complex configurations while still maintaining edge tension to prevent leakage and damage to the substrate underneath.
VJ Electronix to Showcase Leading Processes at NEPCON South China 2010
VJ Electronix Inc., the leader in Rework technologies and global provider of advanced X-ray inspection systems, announces that it will exhibit and demonstrate X-ray and Rework solutions in distributor Kasion's booth 2C41 at the upcoming NEPCON South China 2010 exhibition and conference. The event is scheduled to take place August 31- September 2, 2010 at the Shenzhen Convention & Exhibition Centre.
AOI helps Wilson Process Systems improve quality and yield
Wilson Process Systems is increasingly relying on automated optical inspection methods to reduce defects and improve yield with the ever-more complex PCB assembly work the company is undertaking.
Boundary Scan Software Platform SYSTEM CASCON provides Test Vector Link for IEEE1450 (STIL)
GOEPEL electronic, world-class vendor of JTAG/Boundary Scan solutions compliant with IEEE Std.1149.x introduces a new test vector interface as a new extension of its software platform SYSTEM CASCON™.
Blakell Europlacer’s Pick and Place Machines Offer a Complete Range of Board Handling Equipment
Blakell Europlacer announced that conveyors, buffers, loaders and unloaders, gates, turn units and workstations are features that are available as standard and customized products and can be developed on request in order to fit special requirements.
Pressurex Pressure Indicating Sensor Film Increases Bond Strength and Reduces Defects in Ultrasonic Welding of Electronics
Ultrasonic Welding (USW) is a joining technique that uses high-frequency ultrasonic acoustic vibrations to create solid-state welds. In the electronic, computer and electrical industries, ultrasonic welding is often used to join wired connections and to create connections in small, delicate circuits. Junctions of wire harnesses are often joined using ultrasonic welding. Electric motors, field coils, transformers and capacitors may also be assembled using this process.
Verigy Adds Direct-Probe Solution to its V93000 Platform for the Wafer-Level CSP Market
Verigy has extended the scalability of its production-proven V93000 platform by adding the Direct-Probe solution. This high-performance probe test capability for digital, mixed-signal and wireless communication ICs delivers one of the highest signal integrity levels available for production-volume, multi-site probe testing.
New Optical Inspection System for Automated Conformal Coat Inspection
GOEPEL electronic offers a system for the automated optical inspection of fluorescing conformal coating. The TOM system (Teachable Optical Measurement) can be utilised for inspection of PCB coatings as well as PCB areas, which mustn't be coated. The maximum PCB size is 460 X 400 mm.
Thermal Gap Fillers Combine High Performance and Low Pricing
New TP-S30 thermal interface pads from MH&W International provide 3.0 W/mK of thermal conductivity between hot components and heat sinks at lower costs than competing gap filler materials. Pads of TP-S30 thermal gap fillers are soft and compliant for easy compression and filling of air gaps between mounting surfaces to optimize heat transfer. Applications for these gap fillers include alternative energy, consumer electronics, telecommunications, power supplies, flat panel displays, and portable electronics.
APS Novastar's LS60V-LED - a New Solution for LED Placements for Short to Medium Run SMT Assembly
APS Novastar, LLC announced the release of its LS60V-LED Automated SMT Pick and Place machine. The LS60V-LED specifically addresses customers' requirements for longer LED panel lengths, LED package nozzle dimensions and material selection, and utilizes APS Novastar's proprietary touchless centering system, providing placement rates of up to 4800 cph. The new LS60V-LED handles panels up to 800mm in length and is available with an array of nozzles designed for the most common LED packages from CREE, Nichia, and Philips Lumileds and Luxeon. Custom manufactured nozzles are available to address a customer's specific application needs.
GORE UPW Filters Improve Water Quality and Particle Retention in Microelectronics Manufacturing
W. L. Gore & Associates is offering a new family of highly efficient cartridge filters that improve water quality and reduce total cost of filtration for ultrapure water (UPW) and de-ionized (DI) water used in the manufacture of semiconductors and silicon wafers.
EE Technologies Selects DEK Horizon 03iX for Showcase Rapid Prototype Line
Expanding on its seven existing SMT lines, Reno, Nevada-based contract manufacturer EE Technologies (EET) recently added a state-of-the-art eighth assembly line specifically to showcase its unique approach to rapid prototype production. Having had a very positive experience with the DEK printers in its other seven lines, EET again choose DEK and has installed the company's latest technology, a Horizon 03iX platform, to extend its rapid prototype capability.
Intertronics announced rapid cure conformal coating
The Adhesives and Dispensing experts at Intertronics once again lead the market with the new DYMAX Multi-Cure 987 conformal coating which meets the requirements of MIL-1-46058C and IPC-CC-830B. It is specifically formulated for rapid room temperature cure when exposed to UV and/or visible light. Any coating in shadowed areas on densely populated circuit boards may be cured with heat. Based on DYMAX Multi-Cure 984-LVUF, the version 987 is designed with better wetting on circuitry and components. This product dispenses easily and cures quickly for precise quantity and placement.
Blakell Europlacer Announces A New Capability For High Speed LED Placement on Ultra Long Boards
Blakell Europlacer Ltd., a designer and manufacturer of comprehensive SMT placement systems for the global electronics industry, announces that the highly flexible, dual gantry IINEO II pick and place machine now provides unrivalled PCB dimensions and is capable of handling oversized PCBs up to 1610 x 600mm with a placement rate up to 27300 cph.
Blakell Europlacer Announces The ii Software Suite
Blakell Europlacer Ltd., a designer and manufacturer of comprehensive SMT placement systems for the global electronics industry, announces the ii suite which includes solutions for managing efficiently your SMT production.
Essemtec Delivers More Than 1500 Reflow Ovens
There continues to be a high demand for high-quality products. This was proven once again with Essemtec's 1500-oven-anniversary celebration in May. Due to innovations and flexible implementation of customer requirements, the Swiss manufacturer has reached a leading position in the market.
The benefits of solder jet printing for all to see on YouTube
So that PCB manufacturers can see for themselves the decisive benefits of stencil-free solder jet printing – which are already enhancing the performance and profitability of more than 100 companies across the UK and Europe - SMT expert MYDATA has set up a new and informative YouTube channel – www.youtube.com/mydataautomation.
EMKA expands range of gasket profiles
EMKA has recently expanded the range of gasket profiles to nearly 500 different types. These moulded gaskets in EPDM, Neoprene, Black Nitrile and natural rubber include many popular specialist U.K. sections for automotive, marine, electrical, electronic, and telecoms/cabinet sealing.
Assembléon Feeder Takes 4-Mm Tape To Improve 01005 Chip Placement And Reduce Waste By 75%
A 4-mm feeder for Royal Philips Electronics subsidiary Assembléon's A-Series pick & place machines improves the reliability of 01005 component placement. Assembléon's ITF3 feeder accepts the new W4P1 all-plastic tape standardized by the International Electrotechnical Commission (under IEC 60286-3-2: Type VI). The tape eliminates the paper dust that can cause bad solder connections to the micro-miniature components. It is also static free, and gives a more stable pick & place operation for a better pick rate. Its smaller size also helps to cut waste by 75% compared with traditional 8-mm tapes on a 2-mm pitch
Accurate Bond-Line Inspection With Red Fluorescence Adhesive From Intertronics
Intertronics' 3-20794 is a new, See-Cure, colour-changing adhesive formulated with Ultra-Red fluorescing technology. This adhesive is designed for rapid assembling of plastic housings, laminations, and other applications typically used for appliance assembly. The bondable substrates include PC, PET, PS, PU, PVC, and ABS. DYMAX 3-20794 cures in fractions of a second when exposed to high-intensity UV light – enabling faster processing, greater output, and lower assembly costs.
PlasmaPro NGP80 Next Generation Plasma System
A leader in tools for etch, deposition and growth, Oxford Instruments has just launched its PlasmaPro NGP80 system. A compact open-loading tool, PlasmaPro NGP80 offers versatile plasma etch and deposition solutions on one platform with convenient open loading. Its small footprint system is easy to site and easy to use, with no compromise on process quality, and with multiple process technology configurations. The PlasmaPro NGP80 is ideally suited to R&D or small-scale production, and can process from the smallest wafer pieces to 200mm wafers.
High-Tech Printer Features Low Operation Costs
At SMT Nuremberg Essemtec presented a new in-line stencil printer named Tucano. It is a development of the SP900 which is improved in terms of speed, accuracy and reliability. Tucano features exceptionally low energy consumption and cost of ownership.
One Part High Strength Epoxy With High Thermal Conductivity Meets NASA Low Outgassing Specifications
Resistance to impact, thermal shock, vibration and stress fatigue cracking is of vital importance in the aerospace, optical, medical and oil/chemical processing industries. Master Bond Polymer Adhesive Supreme 10AOHT-LO is a single component, no mix, thermally conductive compound featuring superior electrical insulation and toughness.
Essemtec to Debut a World's First at SMT Nuremberg, Germany
Essemtec will debut a world's first at SMT Nuremberg, Germany: The SMD pick-and place-machine, Cobra. Innovative technology and new materials make Cobra one of today's most modern and accurate machines worldwide. With this machine, Essemtec is targeting a new customer segment.
Solder jet printing becomes indispensable for STI
While Surface Technology International was evaluating one of MYDATA's innovative MY500 solder jet printers, it secured an order for a project that involved a special and particularly hard to solder component. Conventional screen solder printing couldn't handle the job, but the MY500 coped with ease.
JUKI to Highlight Latest Technology Equipment, Including Flexible Mounters and Intelligent Feeders at SMT/HYBRID/PACKAGING 2010
JUKI announces that it will highlight its latest line-up of brand new and tried and tested equipment, including Flexible Mounters and Intelligent feeders in booth 7-333 at the upcoming SMT / HYBRID / PACKAGING 2010, scheduled to take place June 8-10, 2010 at the Exhibition Centre Nuremberg in Nürnberg, Germany.
JUKI to Highlight Latest Technology Chipshooters at SMT/HYBRID/PACKAGING 2010
JUKI, a world-leading provider of automated assembly products and systems, announces that it will highlight its latest line-up of brand new and tried and tested Chipshooters, in booth 7-333 at the upcoming SMT / HYBRID / PACKAGING 2010, scheduled to take place June 8-10, 2010 at the Exhibition Centre Nuremberg in Nürnberg, Germany.
Wilson Process Systems’ capabilities on show through new video on their website
Wilson Process Systems (WPS), the leading Contract Manufacturer, has added a new video to its website (www.wps.co.uk), which demonstrates its key in-house assembly processes. Covering all stages, including solder paste printing, surface mount assembly, LED/radial assembly, axial assembly, flow soldering, PCB washing, conformal coating and resin encapsulation, the video gives a clear impression of the company's capabilities without resorting to unnecessary backing music or distracting camera angles. Rather like the company itself, the video adopts a straightforward approach, and has been well received by customers.
Kester features Next Generation Solder Paste and Flux at SMT Nuremberg
Kester announces showcase their newest next generation solder paste and flux at the upcoming SMT Nuremberg show, scheduled to take place June 8-10 at the Messezentrum Nuremberg. Kester's recent breakthrough in lead-free technology, NXG1, a lead-free no-clean solder paste, will be highlighted at the show alongside 979T VOC-Free No-Clean Flux and 985M Lead-Free No-Clean Alcohol-Based Flux. Visitors will also have an opportunity to meet Kester's new European Sales Manager, Michael Fullbrecht, and discuss their solder materials challenges with Kester representatives on distributor Eurotool's stand, Hall 9, Booth 512H.
