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Free dispensing guide available from IntertronicsThe "adhere" Intertronics range of dispensing equipment includes automatic, semi-automatic and robotic systems, hand held guns and all the consumables users are ever likely to need for their adhesives or other liquids like inks, coatings, greases or oils. So in order to help production engineers, they are offering a free download of "25 top dispensing tips" – considered an indispensible guide to the ins-and-outs of fluid dispensing, including equipment selection and techniques. Laird Technologies Launches New Online EMI, Thermal Management, and Wireless M2M Solutions Stock LocatorLaird Technologies today announced the launch of its new online stock locator system for EMI, Thermal Management, and Wireless M2M product lines. SchmartBoard Releases Family for SMT ConnectorsSchmartBoard, a company that makes prototyping electronic circuits easier, has announced a new family of boards for prototyping with SMT (Surface Mount Technology) connectors. 
Medical micro-shots from IntertronicsIntertronics have again brought forward an exciting development in fluid dispensing – this time the Fisnar DV509. Intended primarily for medical applications this is a lightweight diaphragm valve designed for precise flow control of low to medium viscosity liquids on a continuous 24/7 basis. The PTFE diaphragm separates the wetted parts from the air supply and therefore it is ideal for dispensing cyanoacrylates, reagents, UV adhesives, paints, inks, solvents, glues, electrolytes, alcohol and other volatile substances. Variants with stainless steel and UHMW bodies/diaphragm are also available. Jabil Jumps Ahead of the Curve with Advanced, New Seamless Touch Screen Integration for Smooth, Sleek 3D Mobile Phone Designs Collaboration with Touch Screen Leader Delivers OEM Benefits of Design Freedom, Supply Chain Optimization and System CostJabil Circuit, Inc. today announced a revolutionary new technology to seamlessly integrate touch screens into molded plastic cover lenses for greatly improved 3D mobile phone designs. This new integrated touch screen solution is the result of the close collaboration and co-development work between Jabil | Green Point, Jabil's Mobility sector group, and JTouch, one of the top five touch screen manufacturers in the world. Using proprietary ultraviolet (UV)-cured glue lamination to improve performance, the new technology gives OEMs greatly expanded design flexibility and higher yields than existing competitive materials. Jabil | Green Point announced the new integration offering here at Mobile World Congress and is demonstrating the high-end solution in stand H59, in hall 2. Jabil Provides Snapshot of the Future with Breakthrough Camera Modules at Mobile World Congress 2010Jabil Circuit, Inc. announced two important breakthroughs in system-on-chip (SOC) embedded camera technology at Mobile World Congress 2010. These new innovations meet a critical market need by enabling manufacturers to take full advantage of major opportunities at both ends of the mobile device spectrum. The MD6054A, a compact 5 megapixel (MP) SOC camera module with autofocus addresses growing consumer demand for high-end optics in an industry standard 8.5 x 8.5 x 6.0mm package, while the PW3625A, the first 2 megapixel SOC reflowable wafer-level camera module in the world, targets the huge, untapped market for low-cost mobile phones. Both were developed by Jabil's Mobility sector group, Jabil | Green Point, which leveraged the expertise of Jabil | Sypro Optics, created from a joint venture with Carl Zeiss. 
Easy in-house custom PCB fabricationVero Technologies, manufacturer of the iconic Veroboard family of prototyping boards, has introduced Fotoboard, a range of single and double sided blank Eurocard PCBs, covered with photosensitive resist. Fotoboard enables custom printed circuit boards to be made to your design in-house quickly and economically, saving time and money in sending files to an external PCB fabricator. The products have potential applications in R & D labs for design proving and realisation, in educational establishments for student projects and for hobbyists and modellers amongst others. 
Aerotech provides enabling positioning technology for nanometre precision direct-write laser applicationOne of the many varied and interesting research projects at the University of Southampton's ORC (Optoelectronics Research Centre) involves direct UV laser writing of integrated optical circuits on specialised glass substrates and on its own patented 'flat' optical cable. With application potential from telecom network components through to lab-on-a-chip (LOC) biological and chemical sensors, the photonic circuits are produced with the help of nanometre level precision positioning systems and motion controls from Aerotech. Rogers Corporation to Present Practical Materials Solutions at IMAPS Device Packaging 2010Rogers Corporation will showcase three of its advanced materials for microelectronics packaging at this year's International Microelectronics and Packaging Society (IMAPS) Device Packaging 2010 event (March 9-10, 2010, Radisson Fort McDowell Resort and Casino, Scottsdale/Fountain Hills, AZ). Rogers Corporation to Present Practical Materials Solutions at IMAPS Device Packaging 2010 PA&E Announces New Ceramic Sealed Hermetic WindowsPA&E is now using its patented ceramic-to-metal sealing technology to manufacture hermetically sealed windows for optical, laser and infrared applications. The unique bonding properties and polycrystalline structure of PA&E's Kryoflex® material now allow the company to produce sight or wave-guide windows that maintain the highest levels of hermetic integrity under the extreme environmental conditions. This new product is particularly well suited for space or defense-related LADAR, laser designation/acquisition systems and medical endoscopes. DEK Solar continues to thrive in China; powers escalating market demandDEK Solar is reflecting on a positive Q4, having sold a record number of photovoltaic metallization lines in China. Most recently, the solar screen printing specialist completed a contract to supply a high-profile turnkey provider in the region with a large number of new metallization lines. Novec EGC-2702 surface modifier coating protects electronic components against moisture and corrosion - rapidly, economically and safely3M launched Novec EGC-2702, a surface modifier coating that provides economic and fast protection against moisture and corrosion in electronics manufacture and assembly. A cost-effective high performance alternative to traditional conformal coatings, Novec EGC-2702 can be applied and dried within seven minutes, which is less than a third of the time of leading existing competitive products. It is also non-flammable and is designed to help electronics companies adhere to environmental, health and safety requirements. Laird Technologies Publishes Thermoelectric HandbookLaird Technologies, Inc., a global leader in the design and manufacture of customized, performance-critical components for wireless systems and other advanced electronics applications, today announced the release of its revised "Thermoelectric Handbook". Task-Matched Cutters and Pliers from AvenSelecting an ideal hand tool for detailed jobs is determined by size, strength, shape and sharpness. Having varied models within reach enhances precision, safety and efficiency. DEK and Maxim SMT Technologies showcase latest innovations at Electronics Next 2010DEK is preparing to showcase a comprehensive range of advanced technologies and processes at this year's Electronics Next exhibition in conjunction with the company's agent Maxim SMT Technologies Pvt. Ltd. Being held in New Delhi over February 24th – 26th, Electronics Next will see the mass imaging specialist demonstrate its state-of-the-art Horizon screen printing platform along with award-winning Productivity Tools from Stand 501. Unisem Advanced Technologies Develops Stress Buffer to Protect Semiconductor Device FeaturesUnisem Advanced Technologies (UAT), a leading provider of wafer bumping technologies, today announced that it has developed a methodology for creating a stress buffer to protect delicate features of semiconductor devices. This customizable stress buffer structure includes a polymer layer formed by one or multiple coatings, and a metal stack overlaying the polymer. High tech consortium starts SUPREME project: ASSEMBLÉON DEVELOPS SUSTAINABLE PICK & PLACE SOLUTIONSRoyal Philips Electronics subsidiary Assembléon has started a research project to develop a new generation of sustainable pick& place solutions for the electronics assembly industry. The new generation will not only pick & place components sustainably; it will also minimize the environmental impact of the machine in its design phase. The project has been recognized by the Dutch government in the form of a substantial financial subsidy to stimulate the innovation. Essemtec introduces simultaneous through-hole LEDs and SMD placementEssemtec introduced the CLM979 Radial Component Feeder that enables the assembly of through-hole LEDs on a standard pick-and-place machine. The feeder releases LEDs from the tape, cuts the wire ends and prepares the component for pickup. 
Assembléon Shows Its New Smart Solutions At Apex 2010Royal Philips Electronics subsidiary Assembléon is showing more 'Smart Solutions' at Apex 2010 (April 6th to 8th, Booth 325) held in Las Vegas, U.S.A. Several initiatives are aimed at helping customers to improve business perfomance and reduce SMT production costs. Assembléon is for example introducing the cost-effective MC-24X – a versatile extension to the company's end of line solutions for high-volume and high-mix production lines. 
PCB Protection with Master Bond’s Conformal CoatingAs conformal coatings are becoming more essential to electronic assemblies, Master Bond broadens their protective conformal coatings line with the addition of UV10LV. A clear, highly non-conductive, UV curing conformal coating, it is designed to restrain the impact of moisture, dust, chemicals, and temperature extremes on electronic circuitry and components. I ts high resilience bonds will not deteriorate even when exposed to adverse environmental conditions including severe heat and moisture . Master Bond UV10LV is a low viscosity UV cure adhesive compound offering an exceptionally fast cure upon exposure to UV light at room temperature. Excellent adhesion properties are obtained with metals, ceramics, glass, paper, many plastic and elastomers. The PCB protection coating achieves bond strength equal or exceeded to those obtained from conventional epoxy resins. 
New Hydrophilic PTFE Filters from Gore for High-Purity Chemical ProcessingW. L. Gore & Associates (Gore) has added hydrophilic PTFE filters to its expanding line of cartridge filters for bulk high-purity chemicals used in microelectronics manufacturing, including LCD, semiconductor, hard disk drive and photovoltaic. GORE® Filters for High-Purity Chemical Processors can be used as drop-in replacements for existing filters to achieve significant flow improvements while maintaining or increasing particle retention. This dramatically increased performance can provide a retention upgrade while maintaining system flow, reducing processing time, or decreasing the number of filters required for a lower total cost of ownership. Wilson Process Systems exhibits full SMT and through hole PCBA capabilities at Southern Manufacturing 2010Wilson Process Systems (WPS), the leading contract manufacturer, is exhibiting its full surface mount and through hole PCB assembly capabilities, plus a range of other outsource manufacturing services at the upcoming Southern Manufacturing exhibition, on February 10 and 11 at FIVE, Farnborough, Hants. 
Ophir-Spiricon Introduces BeamGage Pro, Next Generation Laser Beam Analysis SystemOphir-Spiricon, a leader in precision laser measurement, today at Photonics West 2010 announced BeamGage Professional, the latest addition to the company's family of next generation laser beam analysis systems. BeamGage Professional builds on the features included in BeamGage Standard: BeamMaker beam simulator, automatic camera control for ease of use, and comprehensive set of beam analysis algorithms. Optimal stencil design? DEK shows that it’s elementary…DEK recently encouraged its customers to become 'de-DEK-tives' in order to triumph in a prize draw held on its stand at Munich's Productronica exhibition. Having now revealed the competition winner as Siemens AG's Mr. Stanek, DEK has successfully drawn attention to the critical nature of stencil design in relation to ongoing product reliability. 
Epoxy Manufacturer Releases a Strong Fiber Reinforced Epoxy ResinComprised of an aramid fiber reinforced epoxy adhesive for high performance structural bonding, Master Bond's EP30R features outstanding dimensional stability and enhanced impact resistance. This two part epoxy is formulated to cure at room temperature or more rapidly at elevated temperatures. DEK customers can now extend their Horizon even furtherMass imaging specialist DEK has unveiled further enhancements to its popular Horizon screen printing platform. Now equipped with state-of-the-art new cover packages, Horizon features substantially improved usability and operator access for an additional level of manufacturing flexibility. DEK launches VectorGuard Double Layer Platinum stencilDEK has extended its popular VectorGuard® stencil portfolio with the addition of the double layer Platinum stencil, a unique stencil technology offering manufacturers a series of performance benefits over conventional screens. Launched at the Productronica exhibition in Munich, VectorGuard Double Layer Platinum stencils are an ideal solution for semiconductor applications and component manufacture, meeting the needs of production challenges requiring fine line or mixed feature sizes. 
Reinforced Epoxy Adhesive Improves Structural BondingComprised of an aramid fiber reinforced epoxy adhesive for high performance structural bonding, Master Bond's EP30R features outstanding dimensional stability and enhanced impact resistance. This two part epoxy is formulated to cure at room temperature or more rapidly at elevated temperatures. Master Bond EP30R produces high strength bonds to metals, glass, ceramics, vulcanized rubbers and many plastics. 
Rogers Corporation to Showcase Advanced Materials Solutions at DesignCon 2010Rogers Corporation will feature a variety of its advanced materials solutions for the electronic design and semiconductor industries at DesignCon 2010 in Santa Clara, CA (February 2-3, 2010, Santa Clara Convention Center). Members of Rogers Advanced Circuit Materials (ACM) Division will be available at booth 811 to discuss a number of innovative electronic materials, including Theta printed circuit materials, ULTRALAM 3000 laminates, RO2808 laminates, and RO4000 LoPro circuit board materials. 
Official sales start of Essemtec TowerWith the beginning of 2010, Essemtec is the official world wide distributor of the Tower. 
Undetected Pressure Variations in Flip Chip Assembly Reduce Yields and Raise CostsUndetected bonding pressure variations can result in poor or open flip chip connections, reducing yield and long-term reliability while raising costs. Maintaining a uniform distribution of bonding pressure across a flip chip die assures chip to substrate coplanarity, optimal bump compression, and a controlled, reproducible die to substrate gap. Pressurex pressure indicating sensor film is a valuable assist to today's flip chip bonders which lack the capability to measure pressure variations across the bonding tool but instead rely on average pressure with the assumption that it is uniformly distributed. Now a proven control measure in wafer-to-wafer bonding, Pressurex could extend similar low-cost coplanarity and uniformity control to flip chip bonding. 
Lantronix and Spectrum CNC team up to wirelessly network 250 Computer Numerically Controlled (CNC) machinesLantronix today announced that its MatchPort b/g wireless device server has been chosen by Spectrum CNC, the developer of the most reliable direct numerically controlled (DNC) software to deliver a highly-dependable wireless industrial automation solution. Spectrum CNC has selected Lantronix' MatchPort b/g wireless device server to enable the company to network 250 Computer Numerically Controlled (CNC) machines while eliminating the need for wiring throughout the production floor. 
CIL to demonstrate electronics design and manufacturing capability at Southern Manufacturing 2010Custom Interconnect (CIL) will demonstrate examples of its world-class electronics design and manufacturing capability and show a number of new LED based products on Stand D25 at Southern Manufacturing & Electronics Exhibition to be held at FIVE, Farnborough, Hampshire on February 10th and 11th 2010. IMAPS-UK Prototyping To Production Event Hailed A SuccessUK-Prototyping to Production was the theme for a recent IMAPS-UK event held at Unisem Europe's Advanced Semiconductor and Test facility in Crumlin, South Wales. 
Pentek Introduces Specialized Beamforming Module for PC PlatformsPentek is introducing two beamformer PCIe modules to its expansive product line. Each is a high-speed software radio board for processing baseband RF or IF signals and incorporates unique and powerful beamforming functions. Created to accelerate system level design and lower system cost, the boards bring high-performance built-in features and connectivity to PC platforms. 
Nextreme Announces High Temperature Gold-Tin Thermoelectric Module For Optoelectronic CoolingNextreme Thermal Solutions is now offering an updated version of the OptoCooler HV14 that enables assembly temperatures as high as 320°C. These assembly temperatures make the HV14 compatible with eutectic gold-tin (AuSn) solder — the industry standard process for packaging optoelectronic devices that require tight tolerances. Specific applications include laser diodes, semiconductor optical amplifiers and sensors. 
Saelig Debuts GTO – GUI Software Speeds PCB Assembly Design VerificationSaelig Company, Inc. announces the availability of GTO, - an easy-to-use Graphical User Interface tool, expressly designed to help rework technicians, assembly technicians, and printed circuit board assembly contract manufacturers to easily locate single or multiple components on a PCB. SchmartBoard Offers a $30/Hr. Layout Special For First Time CustomersSchmartBoard has announced a 72% off special for new customers of PCB layout services. SchmartBoard is better known for its line of prototyping products, and less so, for its prototyping related services. SchmartBoard is planning a significant push to introduce companies to our service offerings through the 1st quarter of 2010. To begin the campaign, during the months of December 2009 through January 2010, PCB layout will be offered at 72% off our normal pricing of $108/hr. 
New metal-based inks enable cost-efficient production of flexible antennas for RFID tagsCypoPrint is the name of a new range of metal-based inks from BASF destined for the production of flexible antennas for RFID tags. RFID stands for Radio Frequency Identification and is used to identify and locate goods in a similar way to the barcode system. The non-conductive CypoPrint inks from BASF offer a cost-efficient and more eco-friendly alternative to the current etching technique and represent the first solution for the additive manufacturing of RFID antennas. Permabond Expands Magnet Bonding Adhesive LinePermabond Engineering Adhesives introduces Permabond TA459 for magnet bonding. TA459 used with Initiator 43 is non-corrosive to copper and other electrically conductive surfaces, providing fast durable bonds to magnets and metals. The non-corrosive nature makes the product ideal for enclosed motors. This high viscosity gel is easy to dispense. Bonds develop strength rapidly achieving 50% of the full strength in 15 minutes, which increases line speeds and reduces reject rates. Permabond TA459 has exceptional shear strength, and forms strong bonds to a variety of plated and non-plated surfaces that resist vibration, impact and high temperatures. 
Innovative phase-change TIM boosts productivity and performancePhase-change thermal materials could hardly be easier to use, but The Bergquist Company has further increased convenience and speed by introducing Hi-Flow 330P featuring one dry side and one naturally tacky side enabling efficient handling and dispensing. The new material delivers high thermal performance in addition to productivity benefits, achieving thermal impedance of only 0.17ºC-in2/W at 50 psi. 
Low Density Potting Epoxy Is RF Transparent And Saves WeightIn some applications the weight of potting electronics to protect mechanically or environmentally can be a very significant part of the overall weight of installed equipment – sometimes this can be a problem. Intertronics Have The Answers! The 2 Most Important Questions In Adhesive UsageHow much adhesive has been applied and where? When is the adhesive fully cured? Form-In-Place (FIP) Gaskets – Cheaper Than You Think?Form-in-place (FIP) gaskets have been part of the mainstream enclosure industry for many years but the cost and physical size of robotic application has been a major constraint for SMEs – until now. Those clever people at Intertronics have focused on bench-top robotics and matched compliant gasket materials to provide low cost equipment to suit boxes or housings from 200mm x 150mm, e.g. junction boxes, terminal boxes, control boxes, electronic housings, small mechanical gearboxes or other. They have dramatically cut entry cost to around £4,000 on the smallest – with larger equipment running right up to 800mm x 600mm machines. 
VIGON - New Cleaning Agents for Power ModulesZESTRON has introduced the new water-based VIGON PM series, which was specifically developed for the defluxing of Power Modules and other descrete devises after die attach. DEK and Stencil Franchisee, AGI, Demonstrate Advanced Technology OfferingShowcasing the latest expansion of its global stencil network, DEK and new franchisee, Huntsville, Alabama-based AGI Corporation, opened the doors of their manufacturing operation to local customers recently. Attended by both leading EMS and OEM electronics firms as well as Huntsville's Mayor, Mr. Tommy Battle, the DEK-AGI Open House was a technology-rich event designed to highlight the company's stencil production expertise. Essemtec - ePlace Simplifies ComplexityEssemtec has released the new user interface ePlace together with the Paraquda SMD pick and place system. ePlace defines a new standard: The software turns the operation of a complex machine into a positive experience. 
Fast cure, high performance encapsulant from IntertronicsIntertronics' latest introduction to the world of electronic encapsulants is the Multi-Cure 9001-E series which addresses the age old problems of time and mess/mixing with consummate success. This DYMAX Multi-Cure 9001-E Series of encapsulants cure in as little as 5 seconds to provide superior moisture and abrasion resistance and thermal cycle performance of electronic and microelectronic assemblies. 
Manncorp Introduces Five-second Online Quote Service & New Product PagesWith realization of the importance that price plays in the selection of PCB assembly equipment, www.manncorp.com has been redesigned to furnish a quotation on any product within five seconds. This landmark feature, reportedly unique to Manncorp, is activated whenever the five-second digital timer – appearing on every product page – is clicked. As soon as the user provides the brief identification information required, the countdown begins as the requested quote is instantly processed and e-mailed. Laird Technologies Introduces New EMI Gemini™ Product LineLaird Technologies today announced the release of its new family of multi-extrusion shielding gaskets, EMI Gemini. The new EMI Gemini product line is a convergence of a thin, electrically-conductive filler elastomer gasket layer and an inner, non-conductive silicone coated core gasket. The conductive material portion of the gasket, usually loaded with silver, aluminum, nickel or copper is greatly reduced due to the substitution of the silicone core. The reduction of the conductive material lowers the total cost. Extruded in various sizes and profiles, the gasket retains strong EMI protection performance with a lower deflection while sealing against environmental influences such as moisture and dust. Essemtec Gets The Rights for the Tower SMD component storage systemBeginning in 2010, Essemtec will receive the worldwide distribution rights for the Tower, the SMD component storage system. The Tower is safer, more compact and more flexible than other storage solutions. Essemtec, the Swiss manufacturer of production systems for electronics, will receive the worldwide distribution rights for the Tower, a fully automatic SMD component storage system, beginning next year. Essemtec maintains an efficient distribution and support network with local partners and subsidiaries. It will take over the worldwide organization of sales, service and support for the Tower by January 1, 2010. 
DuPont Microcircuit Materials Introduces LTCCDuPont Microcircuit Materials has announced the introduction of the DuPont™ GreenTape™ 9K7 low temperature co-fired ceramic (LTCC) material system, designed for advanced high-frequency, microwave and millimeter wave electronic circuit applications within the aerospace, automotive, military, consumer electronics and telecommunications industries. DuPont™ GreenTape™ 9K7 LTCC material is a lead-free* glass-ceramic dielectric tape, and is available with compatible gold and silver conductive materials as well as co-fired embedded resistor materials. MCM continues to expand its portfolio of LTCC and other materials systems which combine superior performance with preferred environmental properties. 
Essemtec Delivers 2000th Pick and-Place SystemIn 1998, Essemtec produced its first automatic SMD pick-and-place system, beside their well known manual pick-and-place systems. The concept was groundbreaking and successful. Now, close to 12 years later, Essemtec's placement machines are in use around the world. In October, Essemtec delivered its 2000th pick-and-place system. 
New Clear Encapsulant For Leds From IntertronicsTechnical adhesives specialists Intertronics recently launched their Opti-tec 4200 encapsulant/potting compound and adhesive. This optically clear polyurethane is ideal for use in electronics or electrical equipment which incorporates LEDs or other items where high transparency and aesthetics are important. Its clear, non-yellowing, hard setting properties will be appreciated in outdoor signage, illumination projects, e.g. pathways, swimming pools or fountains and in large public installations. It can be used for protecting photovoltaic and solar panel projects. 
Rogers to Feature Advanced Circuit Materials & Thermal Solutions at IMAPS 2009Rogers Corporation will display a number of its innovative and practical materials solutions for microelectronics packaging and production at the upcoming IMAPS 2009 Conference and Exhibition in San Jose, CA (November 3-5, 2009, at the San Jose Convention Center). Rogers will be represented by both its Advanced Circuit Materials Division (ACM) and its Thermal Management Solutions (TMS) Division at IMAPS 2009 (www.imaps.org), a leading event devoted to microelectronics packaging solutions. 
Laird Technologies Expands EMI Sentry Product PortfolioLaird Technologies has announced the addition of three new products to its EMI Sentry Form-In-Place gasket family. This top-of-the-line Form-In-Place gasket family provides EMI shielding while offering heat and humidity resistance, excellent adhesion strength, and a minimal compression set. These qualities improve reliability by increasing the durability and longevity of assemblies. In addition, fast handling and rapid curing speed up productivity, while increased softness offers the cost saving advantage of volume dispensing. 
Wilson Process Systems wins healthcare COWs contractWilson Process Systems (WPS), the leading contract manufacturer, has recently won a contract to deliver 1000 PCBAs to RDP Health Ltd, one of the UK's foremost manufacturers of medical computing products designed to operate in busy hospital environments. 
Potting Compound Working Life Exceeds Conventional Potting EpoxiesMaster Bond's newly developed EP29LP‑1epoxy is an attractive potting compound for use in large potting and encapsulating applications. Presenting a gamut of significant potting properties, good compound flow, easy set up and convenient handling, it exhibits a remarkably low exotherm, maximum pot life and desirable electrical insulation qualities . The very long working life at ambient temperatures exceeds 6 hours and qualifies this compound for filament winding applications. Its excellent physical strength properties enhance component resistance to thermal shock and it has excellent resistance to chemicals such as fuels, acids, bases, water and salts. SchmartBoard - New Through Hole Board With A TwistSchmartBoard, a company that makes prototyping electronic circuits easier, has released a unique new through hole prototyping board co-designed with the help of SchmartBoard users. Free online helpline from TeknekA free online helpline has been launched by Teknek – the world leader in contact cleaning and yield improvement technology – to assist manufacturers with complex technical issues. The Teknek technical support team has 140 years combined experience of advising manufacturers on all types of technical issues and developing innovative solutions to solve them. Sunburst Electronics and Composiflex Launch Strategic PartnershipElectronic contract manufacturer, Sunburst Electronics (Erie, Pa.), reports that Composiflex, a global supplier of highly-engineered composite products, has selected Sunburst as its strategic partner to offer industry-first, technology/service solutions to the aerospace and military electronics sectors. 
Two Part Epoxy Assures Dimensional StabilityMaster Bond's newly developed EP30LV-1 is a low viscosity, optically clear epoxy for general purpose bonding, coating, sealing and casting. Linear shrinkage after cure is 0.0003 inches/in. Its dimensional stability and low shrinkage make it an ideal optical epoxy. 
Film Promotes Uniform Nip Pressure Distribution to Reduce Dry Film Resist PCB Lamination DefectsPressurex film from Sensor Products Inc. is a quick, accurate and economical way to detect and correct pressure variations in the lamination of dry film resist to the board substrate. When placed between nip rollers in the lamination press, the film instantaneously and permanently changes color directly proportional to the actual pressure applied. 
Sensor Film Minimizes Defects and Improves Quality in Wafer BondingPressurex surface pressure indicaing film from Sensor Products Inc. is a quick, accurate and economical way to detect and correct pressure variations which can result in flaws (defects) in the wafer bonding process. When placed between contacting surfaces, it instantaneously and permanently changes color directly proportional to the actual pressure applied. With Pressurex®, variations in pressure that lead to imperfections (or irregularities) in the bonding process can be accurately detected and corrected -- improving yield, decreasing scrap, and boosting productivity. 
Intertronics demonstrate non-invasive nano particle mixingDelegates at the Nano Forum this year (3rd/4th November @ Hilton, Park Lane, London) will be able to see demonstrations of non-invasive planetary mixing with a variety of materials. The planetary principle does not enfold air so air bubbles are simply not created and without mixing blades or similar the Thinky eliminates extreme stress peaks within the material that could otherwise damage fragile nano-particles. 
Fluorescing adhesives from IntertronicsIntertronics is persuading its customers to "see red" literally. The Ultra-Red fluorescing technology built into many DYMAX adhesives offers assemblers concrete advantages in plastics fabrication. 
Official Opening of ZESTRON’s Technical Center in MalaysiaAs global leader in cleaning solutions and services for the electronic industry ZESTRON has always provided comprehensive technical support to customers everywhere to find the best cleaning process for their requirements. 
Easy and Precise Monitoring of Cleaning BathsThe use of concentrated cleaning agent is a cost-effective solution. However, due to drag-out or dilution the concentration of the cleaning agent may change over time. Thus, continuous monitoring by the operator is necessary. The newly developed ZESTRON Bath Analyzer is an easy to use monitoring kit, which can be applied in a few steps only and no specific operator training is necessary. VectorGuard from DEK now even more accessible for customers in IndiaDEK's popular VectorGuard stencil range is now even more accessible for customers in India, following the extension of the company's successful business partnership with Maxim SMT. Already distributing DEK capital equipment in the region, Maxim SMT will now supply a full range of VectorGuard stencils under license from DEK. DEK’s Paste Roll Height Monitor introduces a new level of process controlDEK has launched its brand new Paste Roll Height Monitor, an easy-to-use productivity tool designed to eliminate defects and improve end-of-line yield. Using lasers to detect the presence of solder paste, the new technology monitors the height of the paste roll to provide operators with a new level of process control. Rainbow promises to revolutionise HDI manufactureA new method of producing High Density Interconnect (HDI) boards is being unveiled by Rainbow Technologies, a sister company to Teknek, the global leader in contact cleaning technologies. Traditional laser systems are expensive to buy and costly to operate. Not only that, their output is notoriously slow – most imaging only one side at a time. Oxford Instruments wins three system order from MCNOxford Instruments Plasma Technology (OIPT) has just received a three system order from the prestigious new Melbourne Centre for Nanofabrication (MCN) in Australia. The systems, two Plasmalab System100 ICP380 tools and a Plasmalab System100 PECVD system, have been bought as part of the Centre's programme to equip their cleanrooms with state of the art instrumentation for nano and micro scale fabrication. 
Innovative shielded window material takes a new approach for optical, electrical and mechanical performanceChomerics Europe, a division of Parker Hannifin, has introduced a new shielded window display material that offers a range of important benefits compared to existing solutions. Winshield C is a cast monomer material that combines excellent physical properties with outstanding electromagnetic shielding performance and optical clarity. Applications include display filtering in test equipment, medical instrumentation, public information displays and military radios and computers. 
Four colour printing directly onto metal front panelsElma Electronic has enhanced its front panel customisation capabilities with the introduction of a new six-colour printing process that enables high definition printing directly onto the base material of front panels. The process gives industrial designers complete freedom to use gradients, tints and other complex shadings in a manner akin to normal printing on paper. As well as providing the control functionality required to operate the equipment, the HMI sets the style and appearance of the complete product, so this new development opens up considerable options for enhancing corporate and product identity. OIPT launches Nanofab800 Agile SystemLeader in processes and systems for etching, deposition and growth, Oxford Instruments Plasma Technology (OIPT), has just launched the Nanofab800Agile System. This new tool extends the Nanofab range of highly flexible tools and proven processes which deliver catalyst treatment and controllable growth of nanotubes and nanowires, in addition to delivering standard & high temperature PECVD. 
Rogers Corp - Laminates for Lightweight, Low-Cost Antenna DesignsThe Advanced Circuit Materials (ACM) Division of Rogers Corp. recently introduced its RO3730 laminates, tailored for the special needs of high-frequency antenna designers requiring cost-effective PTFE laminates. These ceramic-filled laminate materials are reinforced by woven fiber glass with optimized glass and filler loading for excellent structural stability and outstanding electrical performance. 
SMD printing technology dayPerfect solder paste printing is neither coincidence nor witchcraft, but a question of the correct materials and technologies. Essemtec, Koki and Koenen are organizing a printing technology day that will highlight the interaction of paste, stencil, machine and design. The event takes place in Maarssen, Netherlands, on September 30th, 2009 and is free of charge. Agilent Technologies' IO Libraries Suite Now Supports Windows Vista 64-Bit and Windows 7Agilent Technologies Inc. today announced the release of its IO Libraries Suite 15.5 software for using instruments from a test and measurement program. Enhancements include support for Microsoft Windows Vista 64-bit and Microsoft Windows 7 (32-bit and 64-bit). The 15.5 update delivers cutting-edge OS flexibility for users of IO Libraries Suite in the environment of their choice. The Suite 15.5 release demonstrates Agilent's commitment to deliver a reliable connectivity experience for users of electronic test equipment. 
PCB Conformal Coating Features Fast Tack Free CureMoisture-curing silicone conformal coatings are ideally suited as protective coatings for sensitive board components in demanding environments. However, electronic manufacturers avoided the use of silicone coatings in electronic packaging due to their long cure schedule that did not allow rapid assembly. Master Bond has developed a rapid tack free, ready-to-use silicone conformal coating called Master Sil 773, formulated to provide excellent protection to electronic circuitry in high humidity environments as well as upon exposure to shock and vibration. It cures quickly at ambient temperatures to a highly flexible, transparent, low hardness silicone coating. Adhesion to critical board components is outstanding. Form-in-place (FIP) gasketsForm-in-place (FIP) gaskets have been part of the mainstream enclosure industry for many years but the cost and physical size of robotic application has been a major constraint for SMEs – until now. Those clever people at Intertronics have focused on bench-top robotics and matched compliant gasket materials to provide low cost equipment to suit boxes or housings from 200mm x 150mm, e.g. junction boxes, terminal boxes, control boxes, electronic housings, small mechanical gearboxes or other. They have dramatically cut entry cost to around £4,000 on the smallest – with larger equipment running right up to 800mm x 600mm machines. 
Consolidation at AWS as it creates Centre of Excellence for Aerospace & DefenceAWS Group has recently consolidated its two Staffordshire operations at its Newcastle under Lyme site, and in the process, has created a new facility designed for growth incorporating a Centre of Excellence for the production of electronic assemblies for a range of sectors including military and aerospace. 
Rogers Introduces Laminates with reverse-treated copper foilRogers Advanced Circuit Materials (ACM) Division announced its new reverse-treated copper foil option on RO4000® series laminates. The RO4000 LoPro™ laminates are enabled by special interface technology to be made with very low profile reverse-treat copper foil while maintaining copper peel strength equal to or better than standard RO4000 materials. RO4000 LoPro laminates combine the best in class electrical and thermo-mechanical reliability of RO4000 laminates with improved insertion loss and outstanding passive intermodulation (PIM) characteristics. 
Essemtec’s FLX2011-MK Places Smaller Components on Flexible CircuitsThe FLX2011-MK, Essemtec's production center for flexible circuits and membrane keyboards, is now equipped with a jet valve dispensing system, allowing it to place smaller SMD components and LEDs on flexible circuits. The jet valve dispenses small glue dots more accurately and faster than others, and is contactless. 
Moisture-Resistant Gasketing Resin From IntertronicsIntertronics has announced a moisture-resistant gasketing resin from DYMAX for sealing electrical conduit boxes, appliance housings, and critical electronic assemblies and devices. Ultra Light-Weld GA-111 is a UV/Visible light-curable form-in-place (FIP) gasket developed for applications requiring low compression set, tack-free surface, and durable, reliable sealing. It is a soft gasket material with high adhesion to metals while providing a barrier to prevent absorption or penetration of air, dust, moisture, liquids and gaseous substances. Agilent Technologies Introduces NanoSuite 5.0 Software for More Powerful Nanomechanical TestingAgilent Technologies has announced the availability of a new, more powerful version of its popular NanoSuite software package (formerly known as TestWorks). Designed for use with the company's line of nanoindentation and tensile-testing instruments, Agilent NanoSuite 5.0 software offers advanced features such as enhanced imaging capabilities, survey scanning and a new test method development environment. All NanoSuite 5.0 functions have been optimized to help researchers run tests and manage data with unprecedented speed and ease. 
Wilson Process Systems invests in new equipmentWilson Process Systems (WPS) has recently concluded a new round of investment which has seen the company expand its manufacturing capabilities and add a second manufacturing location. The moves are aimed at continuing the Hastings-based company's impressive growth, which has seen WPS more than double its turnover to £10M in the last eight years. 
Medical Devices Adhesives Guide Released By IntertronicsLeading adhesives specialist company Intertronics has released an enhanced version of the comprehensive DYMAX Selector Guide on MD Adhesives for Medical Device Assembly. This valuable tool contains a number of charts intended to help R&D engineers and product designers choose the appropriate adhesive for their application. All DYMAX MD Adhesives are biocompatibility tested in accordance with ISO 10993 and/or USP Class VI. 
Threebond's High Peel And Impact Resistant “Instant” AdhesivesThe ThreeBond 7700 Gold Label series of premium cyanoacrylate instant adhesives has recently been joined by the TB7737 and TB7738 offering ultra high peel and impact resistance by virtue of their added elastomer toughening. This strength enables the TB7737 and TB7738 to be used in areas where conventional "instants" would not survive, e.g. hotter/harsher environments. 
AWS Group expands Fast Track AWS Group capabilityAWS Group has announced that following the success of its 'Fast Track' operation at AWS Cemgraft in Newbury, a similar service and facility has been set up at AWS Ltd on its Newcastle-Under-Lyme site, providing a turnaround of prototyping or urgent low volume production orders within five to ten days. 
National Instruments New Embedded Vision System for Automated Visual InspectionNational Instruments has announced the release of a new embedded vision system that gives manufacturing engineers and system integrators the ability to build high-speed real-time machine vision systems for applications such as sorting products, verifying assembly and inspecting packaging. The NI EVS-1464RT Embedded Vision System is a high-performance, multicore controller capable of processing images from multiple IEEE 1394 and GigE Vision cameras. Additionally, the EVS-1464RT features an extended temperature range, a real-time operating system, a solid-state hard drive and a fanless design, making it ideal for use in harsh industrial environments. 
LED Light Cure Saves Time, Extends LifeThe Bluewave LED system from Intertronics has no bulbs to degrade or need changing, cures without adding heat and offers constant light intensity for thousands of hours without re-calibration. This makes it ideal for visible light spot curing of coatings as well as adhesive bonding of polycarbonate, PVC, PET, metal, glass and many other substrates. 
Conformal coating from Intertronics is Tack Free In 3 MinutesConformal coating of electronic assemblies is an often vital protection measure in industries such as automotive, aviation, consumer electronics, domestic appliances and industrial meters and controls – and it is one much under consideration at the present time. Peter Swanson, M.D. at Intertronics explained "there is always great pressure on cycle time for pcb assembly and the cure time of traditional conformal coatings is frequently seen as a bottleneck. Turbo-Coat dries tack-free in 3 minutes and we are delighted therefore that Techspray have again managed to be one step ahead of the pack. Their Turbo-Coat quick dry product is just what is needed to significantly improve efficiency in this area." Enzmann launches new website as part of company makeoverChristian Enzmann GmbH, the independent supplier of printed circuit board prototypes, quick turns and volume series for the automotive, industrial, medical and aerospace markets has its redesigned web site. Following the recent introduction of a new system for maximum accuracy and precision in registration and drilling of multilayers, Enzmann's new site continues the project of gearing up for a future of next-generation RF designs. 
Low Temperature Cure Surface Mount Adhesive Bonds Micro-Chips In Place at 80°CThe TB2217H low temperature cure chip bonder from ThreeBond offers curing at 80°C and addresses an array of chip bonding issues for manufacturers and rework facilities. This single component epoxy offers ease of handling by syringe and full compatibility with automated dispensing systems to enable chip retention on pcb's going through multi-station lines and wave soldering equipment. AWS increases capability of SMT line to process larger boardsAWS Cemgraft - part of the AWS Group, has recently invested to upgrade its surface mount production line to handle large boards. In response to an enquiry from a leading industrial computer manufacturer, Cemgraft worked with key suppliers including surface mount assembly equipment maker, Juki Automation Systems and reflow oven manufacturer, Heller Industries supplier by ZEN Production Equipment to develop its automated line be able to handle boards measuring 663x145mm. Previously, the longest board that could be handled was 510mm. 
Nextreme Breaks Temperature Barrier With Latest OptocoolerNextreme Thermal Solutions claims its OptoCooler HV14 is the industry's first high voltage, low current thin-film thermoelectric cooler (TEC) targeted at laser diode cooling for the telecommunications market to achieve a 60°C temperature difference between its cold and hot sides. This temperature difference, known as the ΔT, reflects the ability of the device to pump heat efficiently. For customers in the optoelectronics and telecommunications industries, this translates to improved cooling performance, lower input power requirements and greater efficiencies for solving thermal management issues in electronic packages. Six new products to be launched by Teknek at IPC/APEXTeknek, a leader in contact cleaning technology, is to launch six new products at the IPC/Apex show in Las Vegas. Teknek's Surface Mount Clean Machine (SMT09), designed for the electronics assembly market, has not only undergone a redesign but it now incorporates full static monitoring to ensure that static levels on outgoing boards are below levels pre-set by the customer. This machine is combined with Nanocleen, the world's first silicone free contact cleaning system which not only offers unprecedented cleaning performance but also dissipates static. 
Contact Cleaning System From TeknekTeknek has launched Nanocleen, said to be a new generation of contact cleaning technology with advanced contamination and static control features. At the core of the Nanocleen system is a specially formulated roller and adhesive roll. 
SIPLACE 3x8 mm shutterless S-feeder improves component supplyS-series tape feeders have been important components of Siplace placement machines for many years. With its new 3x8 mm shutterless S-feeder, Siemens Electronics Assembly Systems (SEAS) has introduced another improved version in the series. Fewer movable parts mean longer life and more reliability. The new feeder also handles a broader spectrum of components and makes the user's job easier. As a special benefit, owners of classic 3x8 mm feeders can have them upgraded to the shutterless version. 
New website from ThreeBondUnder the heading "Creating our future from a single drop" www.threebond.co.uk is quick and easy to use while covering new products and recent application news presently including motorcycle and electronics assembly, with a standard drill down menu which leads to 14 product areas covering industrial adhesives, locking agents, sealants, electronic adhesives and potting, automotive gaskets, sealants, gaskets and the new Ultra Glass car paint protection system, also cyanoacrylate "instant" adhesives and motor sport products. 
Metal-Core PCB circuits with pre-applied thermal interface material accelerates assembly processBergquist has introduced its T-CLAD Metal-Core PCB circuits pre-applied with Bond-Ply 450 adhesive tape. The reflow-resistant thermal interface tape saves product manufacturers from manually applying thermal interface material after assembly. This streamlines production, allowing to quickly bond the MetalCore PCB to a heatsink avoiding laborious attachment of individual screws or clips. 
Harwin launches high quality subcontract manufacturing servicesHarwin announced the formal launch of its subcontract manufacturing capabilities at the Southern Manufacturing & Electronics Exhibition. In fact, Harwin has always undertaken contract manufacturing work utilising the capacity that it has in its manufacturing facility. Harwin has a policy of replacing all its production equipment - stamping, turning, moulding and plating – every five years, so the company always has a state-of-the-art facility which is required to support the manufacture of its high reliability interconnect components. 
New Vision Makroptic Delivers Digital InspectionVision Makroptic is a new digital inspection system from Vision Engineering, designed to view, inspect and capture high resolution images. With a 36x optical zoom, Vision Makroptic can capture samples up to 205mm wide; then simply zoom in for further feature analysis. AWS Group investment in new ERP system leads to increased efficiency and reduced costsAWS Group has recently completed the installation of a common, Group-wide Enterprise Resource Planning system which coordinates all the resources, information and activities needed to complete business processes. 
Moisture resistant gasketing resin from IntertronicsIntertronics has introduced a tack-free, soft gasket material from sales partner, DYMAX, for sealing fuel cells, appliance housings, and critical electronic assemblies and devices. Light Weld GA-140 is a UV/Visible light-curable form-in-place (FIP) and cure-in-place (CIP) gasket developed for applications requiring low compression set, tack-free surface, and durable, reliable sealing. It is a soft gasket material with high adhesion to plastics which provides a barrier to prevent absorption or penetration of air, dust, moisture, liquids and gaseous substances. 
Silicon sealants from ThreeBond are ideal for electronicsThreeBond TB1220 series are silicon sealants which show major advances in terms of curing speed and storage. Improvements have been achieved, making the TB1220 adhesive sealants especially suitable for bonding, fixing, sealing, coating or potting of electrical and electronics parts, also in sealing connectors, dielectric sealing and in moisture proof coating. AWS Group delivers Whole Life Support servicesThrough strategic acquisition and a planned business approach, AWS Group, one of the UK's leading independent Electronic Manufacturing Solutions (EMS) providers, is now is an excellent position to offer Whole Life Support services to the electronics manufacturing sector. The group comprises AWS Cemgraft, AWS Electronics, AWS Slovakia and AWS Jantec, with each company specialising in a different manufacturing function, from initial design and prototyping, through volume manufacture to maintenance and repair. 
Fabs that benchmark perform better says NMIBenchmarking is a vital activity for the UK and Ireland's semiconductor manufacturers according to a recent survey by the National Microelectronics Institute (NMI), the trade association representing the semiconductor industry in the UK and Ireland. The survey entitled 'How do you measure up?' analysed data from the 15 wafer fabrication plants in the NMI's membership, representing the majority of the manufacturing capability in the UK and Ireland. It addressed topics including yield, cycle time, technical capability, productivity, operational efficiency, industry suppliers and human resources. 
EMI gasket from Chomerics delivers 70dB shielding effectivenessChomerics Europe, a division of Parker Hannifin, has introduced a new ultra-soft moulded elastomer EMI shielding gasket. CHO-SEAL 1270 is ideal for use in designs where superior mechanical performance, excellent electrical conductivity, and long term stability are required. Typical applications can be found in handheld electronics, infotainment systems, test equipment, military electronics, navigation devices, ruggedised computers and routers 
Low closure force EMI shielding gasket from Chromerics now available in strip formSOFT-SHIELD 4850 from Chomerics Europe – a division of Parker Hannifin, is now available in convenient strip form as well as sheet material. SOFT-SHIELD 4850 is an EMI shielding gasket that utilises multi-planar, Z-axis conductive foam technology to help it deliver shielding effectiveness in the range of 70 to 80dB. The material has a lower closure force, lower compression set, and is up to 20% lower cost than fabric-over-foam gaskets. 
134.2KHz LF RFID Ear Tag is suited for cattle or pigs lifecycle trackingDAILY RFID CO.,LIMITED has announced the launch of new LF(125KHz and 134.2KHz) RFID Ear Tags for animal tracking and management.The RFID ear tag is constructed from polyurethane,which is used in healthcare,specially for better control of livestock disease . 
RFID Metal Tag-08, the smallest RFID tag for metal surfacesThe leading RFID products producer in China-- DAILY RFID（www.rfid-in-china.com）,has developed HF Metal Tag-08 RFID tag for use in metallic enviornments.This passive RFID tag is designed in a very small size only diameter 13mm round and suitable for on metal tagging,with a reading range of up to 3cm.The price is even lower than 1.0 USD. Altatech Introduces Advanced Materials CVD and ALD ToolAltatech Semiconductor has announced the AltaCVD, an advanced materials chemical vapor deposition (CVD) and atomic layer deposition (ALD) tool. Based on Altatech's vaporizing technology enabling the deposition from new, viscous and non-volatiles precursors, AltaCVD offers new capabilities to R&D facilities and pilot productions lines. Altatech Adds Features to its High Throughput Wafer Macro Inspection SystemAltatech Semiconductor has made major enhancements to AltaSight, its full field high throughput wafer macro inspection system. The novel concept of wafer positioning allows the system to simultaneously inspect the front side and the back side of the wafer (200/300 mm), while the throughput remains at a high 100 wph. 
ThreeBond launch gold standard in instant adhesivesGeneric Cyanoacrylates have earned the reputation of "instant" adhesives from their ability to be used immediately with little preparation and to cure in very short time periods. ThreeBond TB7700 Gold Series now takes that a stage further with Ultra-fast curing (as low as 2 seconds), very high initial bond strength and enhanced substrate applicability, even encompassing porous or hard-to-bond materials such as PBT, PCM or PPS. It is expected that all types of industrial user will find Gold Standard TB7700 a significant advance over conventional cyanoacrylates. 
Thermal gap filler combines high thermal performance with softness for high-end applicationsChomerics Division Europe has introduced a new thermal interface pad that combines excellent thermal performance and easy compression in high-end gap filling applications in the computer and telecom markets. THERM-A-GAPTM 976 is electrically non-conductive and has a thermal conductivity of 6W/m-k. The material is available in thicknesses of 1mm to 5mm. 
Catalogues from Parker Chomerics describe range of thermal management and EMI extruded gasketsParker Chomerics has introduced new catalogues for its thermal management products and EMI extruded gaskets. The catalogues contain comprehensive physical, electrical, thermal and regulatory information to help design engineers select the most appropriate materials for their applications. 
Tactile Pressure-Indicating Sensor Film Helps Capacitor Manufacturer Hold Tighter Product TolerancesSB Electronics designs and manufactures film capacitor products for today's demanding electronics applications. To maintain continuous improvement of its manufacturing processes, David Bryan, Manufacturing Engineering Manager for SB Electronics, recently specified Pressurex, a tactile surface pressure-indicating film from Sensor Products Inc. Humidity Generator and Controller from Celsum TechnologiesNewly available from Celsum Technologies is the HGC Humidity Generator and Controller, a flexible solution for providing an accurate relative humidity environment for many applications, such as conditioning samples for laboratory and QA testing, and for electronic components assessment. The HGC can control the humidity of a chamber of up to nominally 2,000 ml volume to a relative humidity of 85% at temperatures between 5°C and 85°C. 
Polar Instruments and Xact PCB link increases integrity for high-density PCBsPolar Instruments and Xact PCB have announced a new level of integration between Polar's Speedstack controlled-impedance PCB stackup system and Xact's Gemini-X PCB registration, prediction and control system. As standalone systems, these tools provide fabricators with the industry's leading design tools for PCB fabrication; together, they combine to deliver unprecedented levels of control, accuracy and integrity. EMI/RFI shielding products from TBA Electro Conductive ProductsEMI shielding specialist, TBA Electro Conductive Products (ECP) now offers one of the UK's most comprehensive ranges of Beryllium Copper EMI/RFI shielding strips available from a single source. The company's portfolio of BeCu EMI/RFI shielding products is one of the largest standard ranges of fingerstock profiles available in the UK and, in many instances, the company can despatch from stock. EMS specialist and SC21 leader to demonstrate versatility at National Electronics WeekAWS Group, one of the UK's leading specialist Electronic Manufacturing Services (EMS) providers, will demonstrate its full versatility to visitors at the National Electronics Week exhibition, Earls Court 2, 17th – 19th June 2008. The group now includes a number of complimentary businesses that combine to address the total market for EMS services - from design through manufacture, to contract service and repair. 
Chomerics introduces electrically conductive silver epoxy coatings for EMI shieldingChomerics Europe has introduced two new electrically conductive coatings to provide EMI shielding of electronic equipment enclosures. CHO-SHIELD 576 and 579 provide shielding levels up to 80dB in the 30MHz to 1GHz range. Both may be applied by either conventional spray equipment or a brush. 
ESP Technologies brings Design and Productionisation to the electronics marketESP was formed in 2005 to fill a gap in the market for electronic design services by integrating design capability with follow-through into volume manufacturing. Specialising in the housing, thermal management, EMC design, MMI design and productionisation of electronic products, ESP has established a solid track record in bringing new projects to a successful launch in short timescales. Fully cured dispensed thermal materials combine cost-effectiveness and performance in volume automotive applicationsChomerics Europe has been able to provide a solution to a difficult thermal management application encountered on an automotive ECU produced by one of Europe's leading tier one suppliers. Using its silicone-based THERM-A-GAP™ T630G dispensable form-in-place gap filling material, Chomerics was able to provide a cost-effective solution, well suited to an automated, high volume production environment. Pneumatically operated fluid dispensing valveThe Fisnar CV629 Cartridge Valve is a pneumatically operated valve designed for precision dispensing of all types of fluids, such as solvents, oils, silicones, glues, UV adhesives, inks, etc. Shot sizes may be fine tuned by the adjustment screw at the top of the valve; hence the CV629 valve is recommended for applications where micro deposits are required. Two-part polyurethanes now available from Rapid ElectronicsALH Systems have two new resins in the 2008 Rapid Electronics catalogue. Uniquely, both of these two-part polyurethane's are supplied in a universal cartridge conveniently dispensed from a standard mastic gun. Conductive Adhesive Withstands Severe ConditionsMaster Bond EP11SIC is a cost effective, silver-filled epoxy-resin system featuring exceptionally high electrical and thermal conductivity .It offers the application convenience of a one component system in addition to flexible cure schedules so as to best meet specific processing requirements. It has superior adhesion to both metallic and nonmetallic substrates with a tensile strength greater than 6,000 psi and a tensile shear strength over 1,500 psi. EP11SIC is tough for a filled system and features good resistance to thermal shock, high temperatures and chemicals. It is recommended for bonding, potting, sealing and coating over the wide temperature range of -50°C to over 150°C. 
Fast Track prototyping serviceAWS Cemgraft, a company within the AWS Group, has announced its Fast Track prototyping service can turn around prototype or urgent low volume requests in five to ten days as standard, and when really urgent, the company has managed to deliver in 24 hours. 
Chomerics introduces electrically conductive coatings for EMI shieldingChomerics Europe, a division of Parker Hannifin Corporation, has introduced two new electrically conductive epoxy coatings for shielding of electronic enclosures. Both CHO-SHIELD 576 and CHO-SHIELD 579 offer shielding performance of up to 60 – 80dB in the 30MHz to 1GHz range. 
Improving Industrial Dispensing with Pneumatic ValvesThere are quite a few options when it comes to choosing a dispensing valve, and a plethora of materials which might be dispensed through them. Finding the optimal match is quite complicated - material rheology and reactivity needs to be understood, valve capability identified and proven, and the final outcome defined. Nickel Acrylic Coating provides cost effective EMI ShieldingStatic control specialist, TBA Electro Conductive Products (ECP) now offers nickel acrylic paints in its ECP 500 series surface coatings to provide a cost effective solution for EMI shielding problems in a wide range of applications. 
Reinforced Epoxy features low shrinkage and high physical strengthA nanosilica filled one-component UV curable epoxy called UV22 has been introduced by Master Bond Inc. It has been developed for coating, sealing and encapsulation applications. It features high abrasion resistance, excellent optical clarity, low shrinkage and high physical strength properties. UV22 cures rapidly at room temperature upon exposure to a UV light source and is not oxygen inhibited. It has a service operating temperature range of -50°C to150°C (60 to 300°F). Post curing the UV22 material enhances its temperature resistance profile. Adding heat (90-125°C for 30 minutes) will give it a glass transition temperature of 135°C, far higher than traditional UV systems. The post curing is also effective in increasing its chemical resistance to solvents, acids and bases. 
New cellular mounter increases capacity and productivity; reduces space requirementsSony Manufacturing Systems Europe has announced a new generation of its successful range of high-speed cellular component mounters, providing dramatically increased placement speed and accuracy, combined with small size and cost-effective operation. WORLD-BEATING CONTACT CLEANING TECHNOLOGY FROM TEKNEK AT PRODUCTRONICAThe world's most advanced contact cleaning equipment for the surface mount sector will make its debut on the Teknek stand at Productronica 2007. 
Isopropyl alcohol wipes aid adhesive bondingIntertronics has launched pre-saturated ADH1610 Isopropyl alcohol wipes to aid the formation of better adhesive bonds. Isopropyl alcohol is the solvent of choice for the final preparation, cleaning and degreasing of all substrates prior to adhesive bonding. In addition, it is useful for the cleaning up of many uncured adhesives, sealants and resins. Free sample wipes are available from Intertronics via www.intertronics.co.uk 
Adhesive offers Strength, Toughness and Chemical ResistanceMaster-Bond EP30D-12 is a 7500 psi tensile strength adhesive with a 440% elongation that resists thermal cycling, chemicals and water/humidity. Easily processed due to its low viscosity, it adheres well to many substrates and cures with minimal shrinkage. Operating temperatures are -50˚C to 120˚C. 
IBM¹s CMOS image sensing technology now available at low cost through MOSIS multi-project wafer servicesMOSIS, a provider of low-cost prototyping and small volume production services for custom ASICs, announces availability of IBM's image sensing technology (CIMG) through its multi-project wafer (MPW) service. This means that companies working on imaging applications for everything from camera phones to high end digital cameras can access the technology at less than one-tenth of the cost of using a dedicated wafer run. They share wafers with other designs, paying only for the proportion of each wafer that they use. 
Omnetics offers precision over-moulding serviceOmnetics, the manufacturer of miniature high rel connectors, now offers a precision over-moulding service, enabling defence, medical and other high reliability applications to benefit from having electrical connectors moulded into equipment housings. This ensures that contamination is minimised, and enables easy sterilisation. There can also be significant savings in space, weight and cost. Patented stereo microscope has no eyepieces – goodbye eye fatigueVision Engineering's newly updated Lynx stereo microscope employs patented optical technology to remove the need for restrictive eyepieces of a conventional microscope. The result is an inspection system providing amazing optical clarity, without the associate eyestrain or fatigue normally associated with prolonged microscope use … now LOWER COST with brighter, whiter long-life LED illumination. 
Process air heater for applications up to 650 degrees CHawco Group, the specialist supplier of industrial automation and control solutions, temperature management and circuit protection devices, in association with Osram Sylvania offers an accurate, versatile process air heater for applications up to 650 degrees Celsius. Designated Skorpion, the air heater provides fully closed-loop PID regulation with a temperature accuracy of ±1 degree via an on-board controller. 
New R/flex JADE™ A Series From Rogers Corporation Integrates Green TechnologyIn response to global demand for environmentally friendly solutions, Rogers Corporation has developed a halogen-free, transparent epoxy polyimide laminate system that is safe for the environment and delivers superior performance in an all-inclusive package for flexible circuit designs. An extension of the Rogers R/flex CRYSTAL® product line, the new R/flex JADE™ A epoxy adhesive system is ideal for a wide range of applications including hard disk drives, cellular phones, laptop computers, personal digital assistants and semiconductor packaging applications. 
Military certification for HumiSeal’s UV40 rangeLeading vendor of conformal coating solutions, HumiSeal®, has announced that it has successfully achieved MIL-I-46058 certification for its UV curing products UV40 and UV40LV. This latest round of certification means that the company now offers the widest range of Military and UL (Underwriters Laboratories) certified products in the industry across all of the chemistry types. 
Adhere diaphragm valve dispenses UV adhesivesDispensing of UV adhesive is a subject close to the hearts of the people at Intertronics so they are pleased to introduce the new DV509-UV-LF. This diaphragm valve dispenser comes from the same world leading stable at I&J Fisnar as the pneumatic controller which makes this such an easy to use package, especially for UV curing resins. The valve's high cycling rate of 200 per minute makes it ideal for automated systems in all industries. 
Thermal paste application service is said to guarantee high and reproducible qualitySEMIKRON has increased its portfolio of technical and logistics services to include the application of thermal paste to power modules. The introduction of this new service sets SEMIKRON apart from other power semiconductor manufacturers, by enabling it to offer a high and reproducible level of quality. The optimum application of thermal paste onto the semiconductor module ensures good thermal performance once the module is assembled on the heat sink. Too much paste reduces the thermal impedance and can in extreme cases lead to cracking in the insulating ceramic substrate during assembly. Too little paste results in thermal overload of the power semiconductor, which shortens module service life. 
New LTCC substrate foundry service from KOAThe needs for miniaturization, increased reliability and operation at elevated ambient temperatures have driven the development of ceramic based substrates and packages for electronics during the past decade. Among other technologies, LTCC have proven their superior performance in many applications, comprising high temperature automotive as well as high reliability medical and high frequency communications applications. Another application area is the production of packages for micro mechanical electrical systems (MEMS). 
Adapt, Adopt, Improve - Thinky at DeutschIt seems to the adhesives specialists at Intertronics that the whole point of technology in industry is to raise quality and/or reduce costs - in other words - to do a job better - often by simplifying multiple tasks or functions into one single operation. 
Huntsman introduces smart Araldite adhesives for RFID company TAGSYSHuntsman Advanced Materials announces the creation of two specialist Araldite adhesives for use in Radio Frequency Identification (RFID) tags designed by TAGSYS - a global leader in the development of RFID systems 
Cartesian Dispensing robot avoids contact contaminationIntertronics has undertaken trials at product partner I&J Fisnar related to a proven method of automatically applying conformal coating to PCB areas surrounding contacts that may be sensitive to possible spray contamination. The trials used an I&J Fisnar Dispensing Robot complete with a brush applicator and suitable valve system. 
Vicor Announces V•I Chip™ Through-Hole Packaging OptionVicor announces the immediate availability of a through-hole packaging option for all V•I Chips including MIL-COTS. This is in addition to existing surface mount (SMT) compatible packaging, doubling the available range. 
Intertronics - Digital liquid dispensing for all budgetsReliable accurate dispensing of a wide range of liquids from watery ones such as cyanoacrylate adhesives to heavy greases is now much easier to achieve with the latest introduction from Intertronics. Flash Programmer said to Cut Programming Time by more than 80%Adaptsys has announced the Flashstream Flash Vector Programming System, offering the industry's fastest programming of NAND and NOR flash memory. Flashstream programs devices at six to 12 times the speed of existing solutions. Programming times are dependant upon device characteristics, and are as low as 2.5 percent above the theoretical minimum programming time. The system offers up to four programming sites per machine, and allows up to four machines to be daisy-chained, providing sixty-four slots to meet the demands of high-volume manufacturing environments. Taping Machine Increases Throughput in Medium-Volume, High Mix ManufacturingV-TEK has introduced the TM-4500 manual taping machine, an ideal solution to help manage part inventories and increase purchasing efficiency. Bulk parts received in tubes are taped and reeled at a rate of up to 6000 units per hour (UPH), depending upon shape and size, an increase of 30% over previous solutions. Typical applications include low- and medium-volume manufacturing, where purchasing full reels of components can be uneconomic, and taping programmed parts prior to pick-and-place. In the UK, France and Eastern Europe, the TM-4500 is available from Adaptsys. New Araldite product range now available from IntertronicsHuntsman Advanced Materials, together with the adhere brand from Intertronics, has launched Araldite 2000 PLUS - a new range of structural adhesives, optimised to help industrial engineers bring complex plastic and metal-based design projects to life. 
Micro-dots for adhesive applicationComing from its partnership with I & J Fisnar Inc, Intertronics has announced a range of dispensing valves including the DV509 diaphragm valve, the VDP150 plunger pump for positive displacement dispensing and the PDV-1000 precision screw unit. These dispensing valves will be of great interest to development or production engineers wishing to achieve micro to medium applications of low to high viscosity materials such as cyanoacrylates, reagents, UV adhesives, paints, inks, solvents, glues, electrolytes, alcohol and other volatile substances. They will find applications across a wide range of industrial situations, e.g. gaskets, potting, filling, and shielding. New ‘Hands-Free’ Ionisation SystemMeech International announces the launch of the new Model 200 Proximity Sensor Switching System for use with its Series 200 range of ionising nozzles. The Meech Series 200 range of ionisation equipment has been specifically designed to exceed the strict requirements of electronics and industrial cleanroom applications. 
Stereo inspection system for PCBsThe Mantis stereo inspection system from Vision Engineering is used worldwide for the inspection and manipulation of PCBs. The expanded eyepiece technology gives users an extremely comfortable ergonomic advantage, especially when inspecting PCBs for long periods. With greater emphasis of health and safety management systems such as ISO 14001, the 'eyepieceless' Mantis ticks all the boxes for operator comfort. 
Conductive sealing compound provides corrosion resistant EMI shieldingChomerics Europe, a division of Parker Hannifin Corporation, has introduced a new corrosion resistant, electrically conductive sealant. CHO-BOND 1016 is a single component RTV silicone filled with nickel-plated graphite particles. 
Flexible epoxy adhesiveIt is unusual to find an all round stick-most-things-to-most-other-things kind of adhesive in a high performance specialist area but, according to Intertonics, the adhere IRS 2125 is such an adhesive. It is a high performance black epoxy resin system with a combination of flexibility and high adhesion strength on materials such as metal, glass, rubber and many plastics, including cable insulations and connector backshells at temperature up to 150°C. Originally developed for cable harnesses, fixing cables into connectors, the IRS 2125 often solves problems where other adhesives are not suitable, offering relative flexibility and high strength adhesion for high technology bonding, sealing and insulating applications. Safe two-part resin systemPolyurethane resin specialist ALH Systems has developed what it says is the safest two-part resin system. The NP2500 resin system goes well beyond the RoHS directive and contains no Mercury catalysts, no Phthalate plasticisers or no monomeric Isocyanates and is classified as non hazardous according to the latest EC criteria. 
Innovative adhesive technology from IntertronicsIntertronics have recently introduced new adhesive technology for PET and R-PET plastics, from DYMAX Corporation, which provides aggressive bonds to a wide variety of engineering plastics. Ultra Light-Weld® 3-20741, the new UV/visible adhesive, cures upon exposure to UV light in seconds to create intrinsically strong clear bonds, while eliminating the marking or discoloration that can occur with heat sealing RF or sonic welding. The adhesive is formulated to provide structural bonds to PET-type resins, and is ideally suited for bonding applications across a wide range of industries. 
645nm Laser Alignment System from Photonic ProductsPhotonic Products, the UK opto-electronics device manufacturer and laser diode specialist is launching a new 645nm laser alignment module which offers unrivalled performance and ease of use at an affordable price, ideal for use in industrial alignment and machine vision, particularly in clothing manufacture and the textile industry. New light curing adhesive for acrylic and polycarbonate vehicle lighting assemblyIntertronics has introduced the DYMAX 3-20469 which features fast cure speeds and the ability to cure through clear, UV blocked plastic and offers advanced features for a variety of vehicle lighting assembly applications. It cures through large gaps and forms excellent bonds and seals on assemblies with unusual shapes and less than perfect fitting joints. Intertronics at the Southern Manufacturing ShowIf you specify or use adhesives then you should visit Intertronics at the Southern Manufacturing Show at Thorpe Park on February 7th and 8th. New products from Intertronics include low cost robotic dispensing and single process mixing/degassing equipment. Ergonomic lead cutters from IntertronicsIntertronics has introduced the Plato range of ergonomic lead cutters. The 170LX in particular provides ESD safe features for trimming of leads, wires etc where ESD damage is a potential problem. This includes fabrication/assembly of electronic devices or board assemblies as well as rework and repair stations. 
Flextac Wire Dots from IntertronicsJumper wires for ECO's and surface conductor repair are a fact of life in circuit board modification and repair. In the past, technicians used messy quick-set glues for attachment. Intertronics now offers an alternative solution, Flextac Wire Dots from CircuitMedic. 
Aeroflex adds support for live receiver and transmitter testing to 6413A UMTS basestation test systemAeroflex has announced that it has added the ability to undertake live receiver testing and transmitter testing including HSDPA on its highly successful 6413A UMTS basestation test system. The capability is ideal for the ongoing maintenance of UMTS basestations to ensure they perform to specification as it enables testing to be undertaken without any disruption to live traffic caused by taking the basestation out of service. 
CRC 201-2102 Professional Circuit Board Repair KitThe new CircuitMedic CRC 201-2102 professional circuit board repair kit from Intertronics is a comprehensive package of equipment and information – it is probably the most complete and versatile circuit board repair kit to be found anywhere. Applications cover removal and replacement of coatings and components, repair of conductors and edge contacts, as well as plated holes, jumper wires, legend masking, key and slot, lifted lands. Naturally the kit includes lead free repair frames. 
Custom fabrication service launched by GTKGTK, the manufacturer of low cost, high reliability interconnect devices and displays is now launching a custom fabrication service with the aim of adding value and reducing time to market for its customers. The company now has the capability to produce sub-assemblies or full product assembly including product development and engineering. PCB encapsulation using insert moulding can be performed; and custom displays – LCD or LED – can be created and delivered even for relatively low order quantity requirements. 
Intertronics introduces Flextac BGA Stencil Rework KitIntertronics are pleased to introduce probably the easiest, most reliable method for stencil printing solder paste on individual Ball Grid Array (BGA) component sites for rework – accurate, disposable Flextac stencils in a complete BGA Stencil Rework Kit. 
Dymax range of adhesives from IntertronicsThe DYMAX range of adhesives from Intertronics is a comprehensive family of specialist coatings, adhesives, encapsulants, potting, sealing and masking products for micro-electronic and opto-electronic manufacture, rework and repair. In particular they are valuable for unitising/strain relief, wire tacking, heat dissipation and ruggedising of assemblies. 
MOSIS deal with SEMPAC cuts packaging costs for custom ASICsMOSIS, a provider of low-cost prototyping and small volume production services for custom ASICs, announces a strategic agreement with SEMPAC that will enable the company to offer customers a low-cost alternative to ceramic packages for VLSI circuits. The deal will give customers who use the MOSIS multi-project wafer (MPW) service access to QFN/MLP, QFP and SOIC/SSP packages from SEMPAC's Open-Pak product line. These pre-molded, air cavity packages meet the latest JEDEC outline and footprint standards. This means that devices can be designed for high volume production with streamlined testing to further reduce costs. 
Electro-Optical component subassembly design and manufacture servicePhotonic Products now offers OEMs and system integrators a versatile and cost-effective subassembly design and manufacture service and one-stop source for precision CNC multi-axis sliding-head milling and turning. OEMs using the streamlined and highly automated service no longer have to order and stock the many different parts making up an assembly; instead, a single part number covers the whole assembly, which is delivered complete and, where relevant, tested and ready for immediate use. 
OK's Extraction Systems Make for Better Lead-Free Working EnvironmentsLead-free reworking processes require higher temperatures and greater use of more active fluxes, which could account for the stronger smell of the gases released during lead-free rework. The often unpleasant odour is a matter of concern for many electronics manufacturing operators, who are worried that it may signal an increased health hazard. Concerned by the acrid odour given off by lead-free fluxes and solder pastes, rework professionals are increasingly calling for better health and safety measures and better fume extraction. 
cDT provides controller for new laser marking systemWhen engraving laser specialist Electrox introduced its new generation Cobra laser marking system, several items were carried over from the previous model, but not the controller. Electrox's design team were attracted by the idea of using a membrane keypad on the control pendant and contacted customKeypads, a division of cDT. UV monitoring made easy by IntertronicsThe new DYMAX Accu-calTM 50 Radiometer from Intertronics is ideal for monitoring UV curing processes. Unlike most radiometers which can only be used either for UV spot systems or for floods or for conveyors, the new device fits all three types of UV curing systems and is ideal for all types of industrial use - whether in R & D or production environments. 
Clear Potting CompoundOpti-tec 7020 from Intertronics is a two part clear liquid silicone which will cure at room temperature or can be accelerated at increased temperatures. It features a non-yellowing catalyst system and a low viscosity which allows ease of flow around complex parts, providing electrical insulation and shock protection. 
Added Flexibility In Soldering And DesolderingOK International announces four new soldering/desoldering equipment packages as additions to its MFR Series. Setting new standards for flexibility, capability, reliability and value in high-performance rework equipment. 
New technology squeegees from Intertronics for new lead-free environmentsINTERTRONICS BEATS LEAD-FREE ABRASION PROBLEMS WITH POLYMER LUBRICATED SOLDER PASTE SQUEEGEES Transition To Lead-Free Soldering made easyTo protect its customers from added investments where none are needed, OK International has developed a series of cost-effective enhancements for its Metcal MX-500 and SP200 soldering systems that optimise them for lead-free manufacture. 
HumiSeal Europe is the new name for ConcoatFollowing its acquisition last year by HumiSeal's parent company Chase Corporation, Concoat Limited has changed its name to HumiSeal Europe Limited, reflecting the global nature of HumiSeal's business. Optically Clear AdhesiveOpti-tec 5013 two pack epoxy from Intertronics offers high optical clarity and fast room temperature cure. It is designed for assembly/repair of glass, quartz, metal, plastics, wood or ceramics in applications such as optical filters, lenses, prisms, opto-electronics, e.g. photonics and LEDs, artwork and sculpture, as well as encapsulation, glob topping, casting and potting - and it is highly effective in restoration of minerals, gems and quartz crystals. Lead free development and evaluation kitsThe new PCB049 board and kit from Intertronics - developed by Practical Components in conjunction with Indium Corp. - is a key resource for evaluating mixed-technology lead-free assembly. This so-called "do everything" kit allows companies to test a wide variety of JEDEC and EIAJ components to ensure that pre-production and re-work assessment can be thoroughly carried out to ensure optimum production performance. 
Hassle-Free Lead-Free Hand SolderingTwo new upgrades from OK International put its successful PS-800 Hand Soldering System at the forefront in lead-free hand soldering. 
Gap filler provides industry-leading thermal performance material designed for demanding applicationsThe Bergquist Company has extended its Gap Pad S-Class range of thermally conductive gap-filling products with the announcement of Gap Pad 5000S35. The new material provides an industry-leading combination of specifications, including thermal conductivity, softness, robustness and ease-of-use, for demanding applications such as cooling laptop CPUs, graphics processors and cards, CD-ROM drives, and voltage regulators. Proprietary software means fast turnaround of complex PCBsBrynleigh Technology of Heybridge near Maldon in Essex has announced an enhanced service for the assembly of complex SMT boards. New software developed in-house will allow the company to offer a faster and more flexible service. 
Cordless two pack dispenser for repetitive applicationsThe EZ-mix®HI from Intertronics is said to be ideal for repetitive application of adhesives or sealants from twin pack cartridges. Its light weight, cordless and drip-free operation will appeal to anyone using standard 50ml twin pack materials in areas as diverse as displays, engineering, dentistry, marine building and agricultural, where the adhesive has to be taken to the workpiece. Component taping machine automatically supports small devicesAdaptsys announces that the popular V-TEK TM-4450 is now available with support for taping of small devices including SOT23, 0805 and 0603 packages. The introduction of this support allows even more packages to be placed into tapes, allowing them to fed efficiently to automatic pick and place machines. Terotest gets sole UK distribution role for Aeroflex's 4200 in-circuit testerIn a recent move to reorganise its UK-based ATE sales force, Aeroflex has appointed Terotest as its sole UK representative for its range of 4200 series in-circuit test systems. 
Conductive Fabric Gaskets are ideal for handheld devicesLaird Technologies has added to its PORON-based family of Conductive Fabric gaskets for liquid crystal display cushioning and EMI protection in handheld monitoring devices. 
Two-part epoxies suit the optics industryThe new Opti-tecTM range from Intertronics has been specially designed for applications in the growing optics industry. They feature superior performance in applications such as fibre optic terminating, and optical assembly and potting. Some are suitable for use in disposable medical devices (ISO 10993), and glass bonding or bonding where transparency is important, as well as optical processing materials and clear silicone encapsulants. The new Opti-tecTM range from Intertronics has been specially designed for applications in the growing optics industry. They feature superior performance in applications such as fibre optic terminating, and optical assembly and potting. Some are suitable for use in disposable medical devices (ISO 10993), and glass bonding or bonding where transparency is important, as well as optical processing materials and clear silicone encapsulants. 
EMI Emissions reduced with on-board grounding contactsOn-Board Grounding Contacts on the pcb are said provide excellent ESD suppression and EMI effectiveness. Frame Grounding contact is also said to be improved. 
Has moving to lead-free caused soldering or desoldering tip problems?The specialists at Intertronics have noticed that being RoHS compliant and lead-free brings all sorts of new issues – so if you have sorted out your machine soldering changes they believe that now is the time to look at your hand soldering, either as part of your normal assembly process, or during rework and repair. 
Transparent bonding for acrylic, glass and polycarbonateDymax 3099 adhesive from Intertronics is considered ideal for all high quality display purposes where clean transparent bonds are needed on acrylic, glass and polycarbonate, either for screens or structural elements. 
Fast UV cure masking protects complex shapes during metalIntertronics has announced SpeedMask masking resins which are designed to replace lacquers, wax, tape and fixtures in metal finishing processes and to fully protect critical surfaces. 
System dispenses to a resolution of 0.02mmThe I&J7100 from Intertronics handles a dispensing area of 200mm x 150mm and is capable of storing up to 100 different programs, but takes up less than ½ metre on the bench. It is ideal for dispensing adhesives, coatings, gaskets, potting, filling and shielding materials to a resolution of 0.02mm. 
System accurately dispenses materials without mess and contaminationThe adhere Autotube from Intertronics dispenses liquids, pastes, greases, silicons or similar materials directly from their collapsible "toothpaste tubes". It minimises messy transfer, as well as air bubbles and contamination, and provides dispensing control and accuracy. Erst extends its development services offering to include full PCB assemblyErSt Electronic has extended the range of its development services to include manufacturing of complete assembled boards and printed circuit boards (PCBs). |
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