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nanosilica,UV curable epoxy,coating, sealing and encapsulation,fast cure,electrical insulativeReinforced Epoxy features low shrinkage and high physical strengthNews Release from:
Master Bond Inc A nanosilica filled one-component UV curable epoxy called UV22 has been introduced by Master Bond Inc. It has been developed for coating, sealing and encapsulation applications. It features high abrasion resistance, excellent optical clarity, low shrinkage and high physical strength properties. UV22 cures rapidly at room temperature upon exposure to a UV light source and is not oxygen inhibited. It has a service operating temperature range of -50°C to150°C (60 to 300°F). Post curing the UV22 material enhances its temperature resistance profile. Adding heat (90-125°C for 30 minutes) will give it a glass transition temperature of 135°C, far higher than traditional UV systems. The post curing is also effective in increasing its chemical resistance to solvents, acids and bases.
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