Production
Plasma-Therm Announces VERSALINE RIE Etch Order
Plasma-Therm LLC, a global supplier of plasma etch and deposition process equipment, is pleased to announce that a leading manufacturer of high technology defense systems from the EMEA region has recently accepted delivery of a VERSALINE® RIE etch system.
Assembleon Robot Reduces Cost Of Memory Module And Back-end Semiconductor Manufacturing
Royal Philips Electronics subsidiary Assembléon's recently released Twin Placement Robot (TPR) is reducing the cost of placement for memory module assembly, and will soon be doing the same for semiconductor backend manufacturing. The TPR fits on Assembléon's A-Series pick & place equipment to give a single platform that can place up to 110,000 ICs and chip components per hour – eliminating the need for a separate line balancing machine. That makes the A-Series ideal for populating pc boards with high IC count, including Solid-State Drives and Flash and DRAM modules. The TPR will also assemble semiconductor dies in their packages, and so soon also promises to revolutionize semiconductor manufacture.
Manufacturers of Membrane Switches, Flexible Circuits and Other Electronic Components Can Get Productivity Enhancements
Manufacturers of membrane switches, flexible circuits and other electronic components seeking the throughput advantages needed to remain competitive in today's global marketplace, can now use Spartanics Finecut Laser Die Cutting Systems with even greater line speeds through the addition of bar codes that automate job changeovers in seconds and on-the-fly.
Antistat to offer new hand held Semi Automatic Splice Tool
Antistat, specialists in ESD Protection, has announced the addition of a new semi automatic splice tool to the existing range of splice tapes and tools.
Thermally Conductive, Low Viscosity Epoxy Features Cryogenic Serviceability
Master Bond EP30FLAO is a two component epoxy resin system for high performance potting, bonding, sealing and coating. It is extremely versatile and can be used in a wide variety of cryogenic applications. This low viscosity epoxy with excellent flow characteristics makes it ideal as a thermally conductive potting compound. It is widely used in the electronic, electrical, computer, metalworking, appliance and chemical industries where electrical insulation, environmental protection and heat transfer is required.
See Eco-Friendly Advanced Electronics Cleaning Solutions by Kyzen
Kyzen Corporation announces that it will showcase its products for any process including AQUANOX® A4703, AQUANOX® A4625B and IONOX® I3302 in booth 2F10 at the upcoming NEPCON South China 2010 exhibition and conference. The event is scheduled to take place August 31- September 2, 2010 at the Shenzhen Convention & Exhibition Centre.
AssemblÉon Robot Reduces Cost Of Memory Module And Back-end Semiconductor Manufacturing
Royal Philips Electronics subsidiary Assembléon's recently released Twin Placement Robot (TPR) is reducing the cost of placement for memory module assembly, and will soon be doing the same for semiconductor backend manufacturing. The TPR fits on Assembléon's A-Series pick & place equipment to give a single platform that can place up to 110,000 ICs and chip components per hour – eliminating the need for a separate line balancing machine. That makes the A-Series ideal for populating pc boards with high IC count, including Solid-State Drives and Flash and DRAM modules. The TPR will also assemble semiconductor dies in their packages, and so soon also promises to revolutionize semiconductor manufacture.
APS Novastar Releases New Video on SMT Stencil Printers for PCB Assembly.
APS Novastar is pleased to announce the release of its new video covering its SPR line of Stencil Printers for printed circuit board (PCB) assembly. This short video, posted on the APS Novastar web site (http://www.apsgold.com/aps/stencil-printer-video.htm), as well as the company's YouTube channel, provides an overview of the SPR Stencil Printer product line and demonstrates the ease of product set up and use.
Tyco electronics’ new printer produces high-quality prints on heat-shrinkable marker sleeves, cable-marker tags, labels
Tyco Electronics launches the TE3112 printer -- a new high-performance, mid-range identification printer designed for high-quality printing on heat-shrinkable marker sleeves, cable-marker tags and labels. Key features of the printer include its center justification of print media, simplified media and ribbon loading procedures and automatic calibration.
Cutting tools for wind energy component machining
The wind energy industry offers significant growth for manufacturing firms with the ambition to diversify into this exciting sector. The opportunity is particularly significant in Europe, where prevailing winds are instigating the development of numerous onshore and offshore wind farms.
Essemtec to Premier Cobra SMD Placer at SMTA International 2010
Cobra is the first SMD pick-and-place system to combine the advantages of a highly flexible pick-and-place with the throughput of a multi-axes placer. From October 24-28, 2010, this new development will be debuted to the US market at the SMTAI exhibition and conference in Orlando, FL.
Swiss-made SMD Production Machines For Mexico
Essemtec will introduce top-quality SMT production equipment for highly flexible production at the upcoming Mexitrónica exhibition, which will take place October 5-7, 2010, in Guadalajara, Mexico. The Swiss company Essemtec is a true turnkey supplier that provides machines and know-how from one source for all production processes.
Intertronics help to unravel the myths and realities of adhesive curing with LEDs
The adhesives specialists at Intertronics have been involved for a long time in the development of LED-powered curing systems, which are continuing to evolve towards the replacement of the conventional lamp-style curing systems that have been the industry standard for more than twenty-five years. This growth in popularity of LED curing equipment is driven by promises of lower operating costs and "green" benefits. Experts are predicting LED curing systems will evolve over time to dominate the light-curable adhesive field – a prediction with which Intertronics M.D. Peter Swanson agree and explains: "The much reduced life cycle costs and greatly enhanced process controllability of LED cure systems represent such major advances over arc-light technology that it seems certain LEDs will continue to replace these arc based processes."
Rogers Teams New RO4460 Prepreg With RO4360 Laminate For Matched 6.15-Dk Multilayer System Solution
Rogers Corporation (NYSE:ROG) has developed the perfect match for their popular RO4360 laminate: RO4460 prepreg. Both materials feature dielectric constant (Dk) of 6.15 ± 0.15 and low dielectric loss of 0.003 at 2.5 GHz. Together, they form an ideal system for fabricating compact, cost-sensitive multilayer high frequency circuits where space is at a premium.
Greener, cheaper and more controllable uva spot-curing
The BlueWave® LED Prime UVA high-intensity spot-curing system features many advantages over conventional spot-curing systems including no consumable bulbs to change, no warm-up, cool cures, and constant intensity for thousands of hours.
Spartanics Finecut-Plus-Rotary Combination Laser Die Cutting and Rotary Die Cutting System Introduced to Worldwide Electronic Components Industry
Manufacturers of membrane switches, flexible circuits and other electronic components seeking the speed and capabilities of rotary die cutters without the bottomless lifetime costs for dies –and also seeking ways to quickly and painlessly transition to short run jobs with the limitless cut configurations now in greater demand-- can now use the Spartanics Finecut-Plus-Rotary---Combination Laser Die Cutting and Rotary Die Cutting System (http://www.spartanics.com/products_detail.cgi?id_num=60&styleid=2).
Aven Maxi-Mag Lamp Enlarges With Wide Field of View and Brightness
A wide-view fluorescent magnifying lamp from Aven, Inc. adds precision and expanded examination area because of its seven-inch lens and 32-watt circular illumination.
INOCART-MSD is a True Solution for Managing Moisture Sensitive Devices
Through its advanced individual cell design, the Inovaxe INOCART-MSD individually manages multiple component reel sizes and waffle trays in a low relative humidity safe storage condition. Included with each multi-award winning INOCART-MSD is the company's revolutionary MSD tracking and timing software solution. This advanced solution continues in the Inovaxe philosophy of inventory control through SINGLE PACKAGE/SINGLE LOCATION.
MIRTEC to Showcase AOI and SPI Inspection Systems at NEPCON South China 2010
MIRTEC, the Global Leader in Inspection Technology, will showcase its advanced AOI and SPI systems at NEPCON South China 2010. MIRTEC will feature the latest in its award winning MV-7 Series ― the MV-7xi In-Line AOI System ― at the upcoming NEPCON South China 2010 show scheduled to take place Aug.31-Sep 2, 2010 in Shenzhen, China. All attendees are invited to visit MIRTEC for a firsthand demonstration of this new technology at booth 2B21
Illuminated Headband Magnifier Merges Convenience and Precision
An illuminated magnifier visor is among the most versatile and portable inspection instruments for basic electronics design, fabrication and inspection applications.
Integrated Technologies Ltd Chooses Blakell Europlacer
Blakell Europlacer Ltd., a designer and manufacturer of comprehensive SMT placement systems for the global electronics industry, announces that Integrated Technologies Ltd is transferring one of its existing SMT assembly lines to its Shanghai facility and has ordered a replacement line from Blakell Europlacer.
Short-travel probe for battery contact applications
The new P909 Series from Peak Test Services is a short-travel probe for battery contact applications. Depending on the application, it can be pressed or soldered to a printed-circuit board or used with a separate receptacle. For soldered use, a high-temperature solder-tight version is available.
Silicone grease from Chomerics combines multiple benefits for challenging military and aerospace applications
Chomerics Europe, a division of Parker Hannifin, has introduced a new conductive grease for use in both static and dynamic applications where good electrical contact is required between mating metallic surfaces. CHO-LUBE® E117 combines electrical conductivity (resistivity of less than 40 mΩ /cm), with lubrication, shielding, corrosion protection and heat dissipation in a single component compound that requires no cure cycle and has shelf life of two years.
IMAPS-UK “Beyond Solder” Technical Seminar Proclaimed A Success
On 30th June 2010, IMAPS-UK held a successful one-day technical seminar in conjunction with the Innovative electronics Manufacturing Research Centre (IeMRC), at the National Physical Laboratory (NPL) in Teddington, London.
Cookson Opens New Flux Manufacturing Facility
Cookson Electronics has constructed a new Alpha soldering flux manufacturing plant at its Enthone 's-Hertogenbosch site, in the Netherlands. The new plant has been designed for optimum flexibility, having no less than 11 mixing vessels and the capability to produce batch sizes from 100 to 7000 litres economically and efficiently. With an annual capacity of 1500 tonnes, the new facility boasts underground raw materials storage capacity of 110 tonnes and IPA storage of 40 tonnes, along with automated dosing; all in one ATEX zoned area. The installation has received independent certification from KIWA and is already in full production.
HCD restructures to service NPI and full production requirements
HCD, the contract electronics manufacturer, PCB design house, cable assembler and box build specialist, has responded to its clients requirements with the creation of a new volume production line in addition to its existing organisation which has been structured to respond very quickly to low volume orders typically placed by companies which are prototyping and trialling new products.
Imec EUV mask cleaning program on track towards EUV mass manufacturing
Imec today reported promising results in its Extreme Ultraviolet Lithography (EUV) mask cleaning program for defect-free EUV masks which are crucial in achieving high chip manufacturing yield. The research program was initiated in collaboration with mask cleaning experts of HamaTech APE GmbH & Co. KG., a fully owned subsidiary of Süss MicroTec AG, and some of imec's core partners.
Imec and ASML demonstrate potential of 193nm immersion lithography with freeform illumination
Imec and ASML collaborated to qualify ASML's Tachyon Source Mask Optimization and programmable illuminator system FlexRay™, proving its potential with the demonstration of a 22nm SRAM memory cell. In October 2010, the ASML XT:1900i lithography scanner at imec will be equipped with FlexRay™, enabling imec to step ahead and further explore the ultimate frontiers of immersion lithography.
Imec reports breakthrough in narrow pitch interconnects
Imec sets major step towards 20nm half pitch interconnects with the realization of electrically functional copper lines embedded into silicon oxide using a spacer-defined double patterning approach.
Intertronics Introduces Light-Curable Maskant For Surface Protection During Harsh Environment Processing
SpeedMask® 730-BT from Intertronics is a DYMAX masking resin, formulated to provide excellent surface protection during chemical milling/etching, plating, anodizing, and aggressive grit-blasting operations, thus aiding in the manufacturing, overhaul, repair and rework of turbine engine blades, vanes and other turbine components, as well as many other metal finishing applications. 730-BT is impervious to most acid and alkali solutions. This next-generation maskant is trimmable for complex configurations while still maintaining edge tension to prevent leakage and damage to the substrate underneath.
VJ Electronix to Showcase Leading Processes at NEPCON South China 2010
VJ Electronix Inc., the leader in Rework technologies and global provider of advanced X-ray inspection systems, announces that it will exhibit and demonstrate X-ray and Rework solutions in distributor Kasion's booth 2C41 at the upcoming NEPCON South China 2010 exhibition and conference. The event is scheduled to take place August 31- September 2, 2010 at the Shenzhen Convention & Exhibition Centre.
AOI helps Wilson Process Systems improve quality and yield
Wilson Process Systems is increasingly relying on automated optical inspection methods to reduce defects and improve yield with the ever-more complex PCB assembly work the company is undertaking.
Boundary Scan Software Platform SYSTEM CASCON provides Test Vector Link for IEEE1450 (STIL)
GOEPEL electronic, world-class vendor of JTAG/Boundary Scan solutions compliant with IEEE Std.1149.x introduces a new test vector interface as a new extension of its software platform SYSTEM CASCON™.
Blakell Europlacer’s Pick and Place Machines Offer a Complete Range of Board Handling Equipment
Blakell Europlacer announced that conveyors, buffers, loaders and unloaders, gates, turn units and workstations are features that are available as standard and customized products and can be developed on request in order to fit special requirements.
Pressurex Pressure Indicating Sensor Film Increases Bond Strength and Reduces Defects in Ultrasonic Welding of Electronics
Ultrasonic Welding (USW) is a joining technique that uses high-frequency ultrasonic acoustic vibrations to create solid-state welds. In the electronic, computer and electrical industries, ultrasonic welding is often used to join wired connections and to create connections in small, delicate circuits. Junctions of wire harnesses are often joined using ultrasonic welding. Electric motors, field coils, transformers and capacitors may also be assembled using this process.
Verigy Adds Direct-Probe Solution to its V93000 Platform for the Wafer-Level CSP Market
Verigy has extended the scalability of its production-proven V93000 platform by adding the Direct-Probe solution. This high-performance probe test capability for digital, mixed-signal and wireless communication ICs delivers one of the highest signal integrity levels available for production-volume, multi-site probe testing.
New Optical Inspection System for Automated Conformal Coat Inspection
GOEPEL electronic offers a system for the automated optical inspection of fluorescing conformal coating. The TOM system (Teachable Optical Measurement) can be utilised for inspection of PCB coatings as well as PCB areas, which mustn't be coated. The maximum PCB size is 460 X 400 mm.
Thermal Gap Fillers Combine High Performance and Low Pricing
New TP-S30 thermal interface pads from MH&W International provide 3.0 W/mK of thermal conductivity between hot components and heat sinks at lower costs than competing gap filler materials. Pads of TP-S30 thermal gap fillers are soft and compliant for easy compression and filling of air gaps between mounting surfaces to optimize heat transfer. Applications for these gap fillers include alternative energy, consumer electronics, telecommunications, power supplies, flat panel displays, and portable electronics.
APS Novastar's LS60V-LED - a New Solution for LED Placements for Short to Medium Run SMT Assembly
APS Novastar, LLC announced the release of its LS60V-LED Automated SMT Pick and Place machine. The LS60V-LED specifically addresses customers' requirements for longer LED panel lengths, LED package nozzle dimensions and material selection, and utilizes APS Novastar's proprietary touchless centering system, providing placement rates of up to 4800 cph. The new LS60V-LED handles panels up to 800mm in length and is available with an array of nozzles designed for the most common LED packages from CREE, Nichia, and Philips Lumileds and Luxeon. Custom manufactured nozzles are available to address a customer's specific application needs.
GORE UPW Filters Improve Water Quality and Particle Retention in Microelectronics Manufacturing
W. L. Gore & Associates is offering a new family of highly efficient cartridge filters that improve water quality and reduce total cost of filtration for ultrapure water (UPW) and de-ionized (DI) water used in the manufacture of semiconductors and silicon wafers.
