News & Analysis
Smart Manufacturing & Engineering Week
Smart Manufacturing & Engineering Week returns on 5-6 June 2024 and is designed to help support the sector in all stages of their smart manufacturing and engineering journeys.
KYZEN to showcase advanced packaging solutions at PCIM
KYZEN, a global specialist in innovative environmentally responsible cleaning chemistries, is excited to announce its participation in PCIM Europe 2024, scheduled to take place 11–13 June 2024 in Nuremberg, Germany.
Weller Tools showcases at SMTconnect 2024
Weller Tools, a specialist in hand soldering solutions, is proud to announce its participation in the upcoming SMTconnect exhibition, scheduled to take place from 11–13 June 2024 in Nuremberg, Germany.
What is fan out wafer level packaging?
Fan out wafer level packaging (FOWLP) is an advanced semiconductor technology designed to enhance performance and miniaturise electronic devices.
Indium to present on alternative solder alloys at SMTA
Indium Corporation Technical Support Engineer, CSMPTE, Thuy Nguyen will present at the SMTA Rocky Mountain Expo on 16th May 2024 in Aurora, Colorado.
Panasonic Industry to exhibit at SPS Parma
From 28-30 May, Panasonic Industry Italia will showcase its offerings at SPS Parma in Italy, located in Hall 6 at Stand H008.
Indium experts will present at Electronics in Harsh Environments Conference
Karthik Vijay, Technical Manager for Europe, Africa, and the Middle East at Indium Corporation, will deliver a technical presentation, while Dr. Ronald Lasky, Senior Technologist, will lead both a workshop and a technical presentation at the Electronics in Harsh Environments SMTA Conference from May 14 to 16 in Copenhagen, Denmark.
UK joins EU supercomputing scheme and opens researcher funding
British researchers, businesses, and academics will have enhanced access to future supercomputer research funding from 13th May 2024 as the UK joins the European High Performance Computing Joint Undertaking (EuroHPC).
Sphere Entertainment acquires HOLOPLOT
Sphere Entertainment announces that it has acquired all of the remaining shares it did not previously own of HOLOPLOT, a global pioneer in 3D audio technology.
Arrow signs EMEA distribution agreement with The Things Industries
Arrow Electronics has announced an EMEA distribution agreement with The Things Industries, a full-service LoRaWAN (Long Range Wide Area Network) solutions provider.